AMD Xilinx
XC6VSX475T-L1FFG1759I
XC6VSX475T-L1FFG1759I ECAD Model
XC6VSX475T-L1FFG1759I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 840 | |
| Number of Outputs | 840 | |
| Number of Logic Cells | 476160 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | |
| Pin Count | 1759 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VSX475T-L1FFG1759I Datasheet Download
XC6VSX475T-L1FFG1759I Overview
The XC6VSX475T-L1FFG1759I chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to increase the speed and accuracy of complex digital signal processing tasks while also reducing power consumption. The model requires the use of HDL language to program and operate, which means that users need to have the knowledge and skills to use it effectively.
The XC6VSX475T-L1FFG1759I chip model offers a wide range of features and capabilities, including high-speed memory, high-performance processing, and low-power consumption. It has been used in a variety of applications, ranging from industrial automation to medical imaging. This chip model is also capable of running complex algorithms, which makes it suitable for applications such as autonomous robots, machine learning, and artificial intelligence.
In order to use the XC6VSX475T-L1FFG1759I chip model effectively, users need to have a thorough understanding of the product description and design requirements. They should also be familiar with the actual case studies and precautions associated with the model. Additionally, users should be proficient in HDL language in order to program and operate the chip model.
The XC6VSX475T-L1FFG1759I chip model is an excellent choice for the development and popularization of future intelligent robots. Its high-performance processing, low-power consumption, and ability to run complex algorithms make it ideal for this application. In addition, users need to have the technical knowledge and skills to use the model effectively. With the right expertise, the XC6VSX475T-L1FFG1759I chip model can be used to create powerful and efficient intelligent robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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