AMD Xilinx
XC6VSX475T-2FFG1759I
XC6VSX475T-2FFG1759I ECAD Model
XC6VSX475T-2FFG1759I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 840 | |
| Number of Outputs | 840 | |
| Number of Logic Cells | 476160 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | |
| Pin Count | 1759 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC6VSX475T-2FFG1759I Datasheet Download
XC6VSX475T-2FFG1759I Overview
The XC6VSX475T-2FFG1759I chip model is a high-performance digital signal processor, embedded processor, and image processor, all of which require the use of HDL language. This chip model is increasingly being used in a variety of industries, including aerospace, automotive, industrial, medical, and consumer electronics.
The XC6VSX475T-2FFG1759I chip model offers several advantages over other chip models. It has a high-speed processing capability and is capable of handling complex tasks. It is also highly reliable and can operate in harsh environments. Additionally, it has a low power consumption and is cost-effective for many applications.
The XC6VSX475T-2FFG1759I chip model is expected to have a growing demand in the future, as more industries are beginning to use the chip model for their applications. This chip model is well-suited for applications that require high-speed processing and complex tasks. Furthermore, its low power consumption and cost-effectiveness make it attractive for many industries.
The application environment of the XC6VSX475T-2FFG1759I chip model may require the use of new technologies, depending on the specific technologies needed. For example, if the application requires the use of advanced image processing algorithms, the chip model may need to be upgraded to support the new algorithms. Additionally, if the application requires new communication protocols, the chip model may need to be upgraded to support the new protocols.
The XC6VSX475T-2FFG1759I chip model is expected to have a growing demand in the future as more industries are beginning to use it for their applications. As the technology continues to advance, new technologies may be required to support the chip model's application environment. This will likely lead to an increased demand for the chip model, as it is well-suited for applications that require high-speed processing and complex tasks. Additionally, its low power consumption and cost-effectiveness make it attractive for many industries.
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