AMD Xilinx
XC6VSX475T-L1FFG1759C
XC6VSX475T-L1FFG1759C ECAD Model
XC6VSX475T-L1FFG1759C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 840 | |
| Number of Outputs | 840 | |
| Number of Logic Cells | 476160 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | |
| Pin Count | 1759 | |
| ECCN Code | 3A001.A.7.A |
XC6VSX475T-L1FFG1759C Datasheet Download
XC6VSX475T-L1FFG1759C Overview
The Xilinx XC6VSX475T-L1FFG1759C is a mid-range, low-power, high-performance Field Programmable Gate Array (FPGA) chip model. It is designed to provide a cost-effective solution for a wide range of applications, from industrial automation to consumer electronics. This chip model is based on the latest Xilinx Virtex-6 FPGA family, and it offers a wide range of features and capabilities for users.
The XC6VSX475T-L1FFG1759C is designed to provide high performance, low power consumption, and high reliability. It offers a wide range of features and capabilities, including support for multiple clock frequencies, high-speed I/O, and advanced communication systems. It also offers support for a wide range of programming languages and development tools, making it an ideal solution for a variety of applications.
The XC6VSX475T-L1FFG1759C is designed to meet the needs of a wide range of applications, and it is expected to be in high demand in the future. It is expected to be used in a variety of industries, including industrial automation, consumer electronics, automotive, and aerospace. The chip model also has the potential to be used in advanced communication systems, such as 5G and beyond.
The Xilinx XC6VSX475T-L1FFG1759C is designed to be flexible and expandable, and it has the potential to be upgraded to support new technologies in the future. The chip model is designed to be highly reliable and is expected to be a long-term solution for many applications. It is also designed to be easy to program and debug, making it an ideal solution for a variety of applications.
In conclusion, the Xilinx XC6VSX475T-L1FFG1759C is a high-performance, low-power, and reliable chip model that is designed to meet the needs of a wide range of applications. It is expected to be in high demand in the future, and it has the potential to be upgraded to support new technologies. It is also designed to be easy to program and debug, making it an ideal solution for a variety of applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||