AMD Xilinx
XC6VLX550T-L1FFG1759I
XC6VLX550T-L1FFG1759I ECAD Model
XC6VLX550T-L1FFG1759I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 840 | |
| Number of Outputs | 840 | |
| Number of Logic Cells | 549888 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | |
| Pin Count | 1759 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VLX550T-L1FFG1759I Datasheet Download
XC6VLX550T-L1FFG1759I Overview
The chip model XC6VLX550T-L1FFG1759I is a FPGA product manufactured by Xilinx. It is a powerful device with high performance and low power consumption, making it ideal for a variety of applications. It is based on the Virtex-6 FPGA architecture and is designed to be highly configurable and flexible.
The chip model XC6VLX550T-L1FFG1759I features a range of features that make it suitable for a variety of applications. It has a high-speed, low-power transceiver, a high-speed serial interface, and a wide range of I/O options. It also offers a range of power-saving features, such as dynamic power management, which can help reduce power consumption.
In terms of industry trends, the chip model XC6VLX550T-L1FFG1759I can be used in a variety of applications, such as industrial automation, wireless communication, and medical devices. It is also suitable for advanced communication systems, as it is capable of supporting high-speed data transfer and has a wide range of I/O options.
When it comes to the future development of the chip model XC6VLX550T-L1FFG1759I, the possibilities are endless. It can be upgraded to support new technologies, such as 5G networks, or it can be used in more advanced applications, such as artificial intelligence. It is also possible to upgrade the chip model XC6VLX550T-L1FFG1759I to support new technologies, such as the Internet of Things (IoT).
In terms of product description and design requirements, the chip model XC6VLX550T-L1FFG1759I is designed to be highly configurable and flexible. It has a wide range of I/O options and can be used for a variety of applications. It is also designed to be highly reliable and has a range of power-saving features.
When it comes to actual case studies and precautions, it is important to take into consideration the specific application environment and the specific technologies that are needed. It is also important to consider the chip model XC6VLX550T-L1FFG1759I’s original design intention and the possibility of future upgrades. Additionally, it is important to consider the power consumption of the chip model XC6VLX550T-L1FFG1759I and the potential impact of new technologies on the device’s performance.
Overall, the chip model XC6VLX550T-L1FFG1759I is a powerful and versatile device that can be used in a variety of applications. It is designed to be highly configurable and flexible, and it has a range of power-saving features. It is suitable for a variety of industry trends and can be upgraded to support new technologies. However, it is important to consider the application environment and the specific technologies that are needed, as well as the chip model XC6VLX550T-L1FFG1759I’s original design intention and the possibility of future upgrades.
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