AMD Xilinx
XC6VSX475T-3FFG1759C
XC6VSX475T-3FFG1759C ECAD Model
XC6VSX475T-3FFG1759C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of CLBs | 37200 | |
| Combinatorial Delay of a CLB-Max | 590 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 37200 CLBS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC6VSX475T-3FFG1759C Datasheet Download
XC6VSX475T-3FFG1759C Overview
The chip model XC6VSX475T-3FFG1759C is a high-performance digital signal processing chip that is suitable for embedded processing, image processing, and other applications. It requires the use of HDL language, which is a hardware description language that allows for the design of digital systems such as computers, microprocessors, and digital logic circuits. With its high-performance capabilities, the chip model XC6VSX475T-3FFG1759C has the potential to be used in a wide range of applications in the future.
In terms of networks, the chip model XC6VSX475T-3FFG1759C can be used in a variety of intelligent scenarios, such as intelligent home systems, autonomous vehicles, and smart cities. It can be used to develop and implement intelligent algorithms that can process data quickly and accurately. In addition, the chip model XC6VSX475T-3FFG1759C can be used in the era of fully intelligent systems, such as the Internet of Things (IoT) and artificial intelligence (AI). It can be used to develop and implement algorithms for machine learning, natural language processing, and computer vision.
The chip model XC6VSX475T-3FFG1759C can also be applied to the development and popularization of future intelligent robots. It can be used to develop and implement algorithms for motion control, object recognition, and navigation. In order to use the chip model XC6VSX475T-3FFG1759C effectively, technical talents such as software engineers, electrical engineers, and robotics engineers are needed. They will be responsible for designing, developing, and implementing the algorithms that are necessary to make the robots intelligent and functional.
Overall, the chip model XC6VSX475T-3FFG1759C is a powerful and versatile chip that can be used in a variety of applications. It has the potential to be used in networks, intelligent scenarios, and the era of fully intelligent systems. In addition, it can be applied to the development and popularization of future intelligent robots. In order to use the chip model XC6VSX475T-3FFG1759C effectively, technical talents such as software engineers, electrical engineers, and robotics engineers are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||