AMD Xilinx
XC6VSX315T-L1FFG1759I
XC6VSX315T-L1FFG1759I ECAD Model
XC6VSX315T-L1FFG1759I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 314880 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | |
| Pin Count | 1759 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VSX315T-L1FFG1759I Datasheet Download
XC6VSX315T-L1FFG1759I Overview
The XC6VSX315T-L1FFG1759I chip model is a powerful and versatile model that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is capable of providing high-speed performance and is designed to be used with the HDL language. The chip model has a number of advantages that make it an ideal choice for many industrial applications.
The XC6VSX315T-L1FFG1759I chip model has a wide range of features that make it suitable for use in a variety of applications. It has high-speed performance, low power consumption, and a wide range of operating frequencies. Additionally, the chip model is designed to be used with HDL language, which makes it easy to use and program. As a result, the model is expected to be in high demand in the future, as more and more industries begin to adopt the technology.
The XC6VSX315T-L1FFG1759I chip model can also be used in the development and popularization of future intelligent robots. It is capable of providing the necessary speed and power needed to perform complex tasks, and its use of the HDL language makes it easy to program and operate. To use the model effectively, technical talents such as software engineers, hardware engineers, and roboticists are needed.
Overall, the XC6VSX315T-L1FFG1759I chip model is a powerful and versatile model that is suitable for a variety of applications. Its advantages and the expected demand trends for the model in related industries make it a great choice for those looking to develop and popularize future intelligent robots. To use the model effectively, technical talents such as software engineers, hardware engineers, and roboticists are needed.
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2,035 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,064.0479 | $4,064.0479 |
| 10+ | $4,020.3485 | $40,203.4848 |
| 100+ | $3,801.8513 | $380,185.1280 |
| 1000+ | $3,583.3541 | $1,791,677.0400 |
| 10000+ | $3,277.4580 | $3,277,458.0000 |
| The price is for reference only, please refer to the actual quotation! | ||