AMD Xilinx
XC6VLX550T-L1FFG1759C
XC6VLX550T-L1FFG1759C ECAD Model
XC6VLX550T-L1FFG1759C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 840 | |
| Number of Outputs | 840 | |
| Number of Logic Cells | 549888 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | |
| Pin Count | 1759 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VLX550T-L1FFG1759C Datasheet Download
XC6VLX550T-L1FFG1759C Overview
The XC6VLX550T-L1FFG1759C chip model is a powerful and versatile device that is suitable for a variety of applications. It is specifically designed for high-performance digital signal processing, embedded processing, image processing, and other advanced communication systems. The chip model is equipped with a variety of features that make it an ideal choice for these types of applications.
The XC6VLX550T-L1FFG1759C chip model has been designed with the intention of providing users with a reliable and efficient solution for their needs. It is capable of handling a wide range of tasks, from simple data processing to more complex operations. It also features a range of advanced features, such as a high-speed processor, on-chip memory, and a variety of peripherals.
The XC6VLX550T-L1FFG1759C chip model is designed to be easily upgradable, allowing users to upgrade their system as their needs change. This allows users to take advantage of the latest technologies, while still being able to maintain the same level of performance. It also makes it easier to integrate the chip model into existing systems and applications.
In order to make the most of the XC6VLX550T-L1FFG1759C chip model, it is important to understand the product description and specific design requirements. It is important to be aware of the various features and capabilities of the chip model, as well as the potential risks and limitations. It is also important to consider the actual case studies and precautions that may be necessary in order to ensure the optimal performance of the chip model.
Overall, the XC6VLX550T-L1FFG1759C chip model is an ideal choice for a variety of applications. It is designed to provide users with a reliable and efficient solution for their needs. With its range of features, capabilities, and upgradability, it is a powerful and versatile device that is suitable for a variety of applications. With the right knowledge and precautions, it can be used to its full potential.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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