AMD Xilinx
XC6VLX550T-2FFG1759I
XC6VLX550T-2FFG1759I ECAD Model
XC6VLX550T-2FFG1759I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 840 | |
| Number of Outputs | 840 | |
| Number of Logic Cells | 549888 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | |
| Pin Count | 1759 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC6VLX550T-2FFG1759I Datasheet Download
XC6VLX550T-2FFG1759I Overview
The XC6VLX550T-2FFG1759I chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used in combination with an HDL language, such as VHDL, Verilog, or SystemVerilog, in order to achieve optimal performance. This chip model is an ideal choice for applications that require high speed, low power consumption, and flexibility.
The XC6VLX550T-2FFG1759I chip model has a wide range of features, including a high-performance processor, a large FPGA fabric, and a variety of peripheral components. It is capable of supporting a variety of digital signal processing tasks, including image processing, video processing, audio processing, and more. Furthermore, its low power consumption and high speed make it suitable for applications that require high performance with minimal power consumption.
In addition, the XC6VLX550T-2FFG1759I chip model is capable of being used in the development and popularization of future intelligent robots. It is well-suited to the task due to its high-performance processor, large FPGA fabric, and low power consumption. To use the model effectively, technical talents with experience in HDL language programming, as well as knowledge of robotics and artificial intelligence, are needed.
To ensure that the XC6VLX550T-2FFG1759I chip model is used in the most effective way, it is important to consider the product description and specific design requirements. Additionally, it is beneficial to look at actual case studies and take into account any potential pitfalls. By taking all of these factors into consideration, the model can be used to its full potential, allowing for the development and popularization of future intelligent robots.
You May Also Be Interested In
1,135 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||