AMD Xilinx
XC6VLX365T-L1FFG1759I
XC6VLX365T-L1FFG1759I ECAD Model
XC6VLX365T-L1FFG1759I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 364032 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | |
| Pin Count | 1759 | |
| ECCN Code | 3A001.A.7.A |
XC6VLX365T-L1FFG1759I Datasheet Download
XC6VLX365T-L1FFG1759I Overview
The chip model XC6VLX365T-L1FFG1759I is a versatile and powerful processor designed by Xilinx, a leading provider of programmable logic solutions. It is based on the Virtex-6 FPGA family, which is the latest and most advanced FPGA family from Xilinx. This model is designed to provide high performance and scalability for a wide range of applications. It is a high-end FPGA with an advanced feature set, including a high-speed transceiver, high-performance memory, and advanced on-chip debug capabilities.
The XC6VLX365T-L1FFG1759I is a great choice for applications requiring high performance and scalability, such as those in the aerospace, defense, communications, and industrial markets. It offers a combination of features and performance that is unmatched in its class. It is also ideal for advanced communication systems, where its high speed transceiver and advanced on-chip debug capabilities are invaluable.
The XC6VLX365T-L1FFG1759I is designed to meet the needs of the most demanding applications. It has a wide range of features and capabilities, including high-speed transceivers, high-performance memory, and advanced on-chip debug capabilities. It also offers the flexibility to be upgraded to meet the changing needs of the industry. This makes it a great choice for applications that require high performance and scalability.
The XC6VLX365T-L1FFG1759I is expected to be in high demand in the future, as its features and capabilities make it a great choice for a wide range of applications. It is also expected to be used in advanced communication systems, as its high-speed transceiver and advanced on-chip debug capabilities make it an ideal choice for these applications.
The original design intention of the XC6VLX365T-L1FFG1759I was to provide a high-performance, scalable processor for a wide range of applications. Its features and capabilities make it an ideal choice for applications requiring high performance and scalability. It is also expected to be used in advanced communication systems, as its high-speed transceiver and advanced on-chip debug capabilities make it an ideal choice for these applications.
Whether the application environment requires the support of new technologies depends on the specific technologies needed. The XC6VLX365T-L1FFG1759I is designed to be flexible and upgradeable, so it is possible to add new features and capabilities to meet the changing needs of the industry. It is also possible to upgrade the model to support new technologies, such as 5G, Wi-Fi 6, and more.
In conclusion, the XC6VLX365T-L1FFG1759I is a versatile and powerful processor designed by Xilinx. It is expected to be in high demand in the future, as its features and capabilities make it a great choice for a wide range of applications. It is also designed to be flexible and upgradeable, so it is possible to add new features and capabilities to meet the changing needs of the industry. Whether the application environment requires the support of new technologies depends on the specific technologies needed.
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