
AMD Xilinx
XC6VLX365T-L1FFG1759C
XC6VLX365T-L1FFG1759C ECAD Model
XC6VLX365T-L1FFG1759C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 720 | |
Number of Outputs | 720 | |
Number of Logic Cells | 364032 | |
Combinatorial Delay of a CLB-Max | 5.87 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1759 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1759 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1759,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | |
Pin Count | 1759 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC6VLX365T-L1FFG1759C Datasheet Download
XC6VLX365T-L1FFG1759C Overview
The XC6VLX365T-L1FFG1759C chip model is a high-performance and low-power FPGA designed to provide a cost-effective solution for many applications. It is a FPGA with a powerful 6-layer logic architecture and a wide variety of features, such as high-speed transceivers, high-speed I/O, and powerful embedded processors. It is designed to meet the needs of a wide range of applications, including embedded computing, industrial control, and communications.
The XC6VLX365T-L1FFG1759C chip model has been widely used in various network and intelligent scenarios. It has been adopted by many leading companies in the industry for its high performance, low power consumption, and cost-effectiveness. It is also a great choice for the era of fully intelligent systems, as it can provide a cost-effective solution for a variety of intelligent applications.
In terms of industry trends, the XC6VLX365T-L1FFG1759C chip model is becoming increasingly popular, as it is a powerful and cost-effective solution for many applications. It is also becoming increasingly important in the era of intelligent systems, as it can provide a cost-effective solution for a variety of intelligent applications.
When using the XC6VLX365T-L1FFG1759C chip model, it is important to consider its product description and design requirements. The product description should include the features, performance, and power consumption of the chip model. The design requirements should include the specific requirements of the application, such as the number of transceivers, the number of I/O pins, and the number of embedded processors. It is also important to consider the actual case studies of the chip model, as this will help to ensure that the application is using the right chip model for the right application. Finally, it is important to consider the precautions when using the chip model, such as proper cooling, proper power management, and proper testing.
In conclusion, the XC6VLX365T-L1FFG1759C chip model is a powerful and cost-effective solution for many applications. It is becoming increasingly important in the era of intelligent systems, as it can provide a cost-effective solution for a variety of intelligent applications. It is important to consider the product description and design requirements, as well as the actual case studies and precautions when using the chip model.
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