XC6VLX365T-L1FFG1759C
XC6VLX365T-L1FFG1759C
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rohs

AMD Xilinx

XC6VLX365T-L1FFG1759C


XC6VLX365T-L1FFG1759C
F20-XC6VLX365T-L1FFG1759C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, LEAD FREE, FBGA-1759
42.50 X 42.50 MM, LEAD FREE, FBGA-1759

XC6VLX365T-L1FFG1759C ECAD Model


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XC6VLX365T-L1FFG1759C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 720
Number of Outputs 720
Number of Logic Cells 364032
Combinatorial Delay of a CLB-Max 5.87 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1759
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1759
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1759,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 42.50 X 42.50 MM, LEAD FREE, FBGA-1759
Pin Count 1759
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC6VLX365T-L1FFG1759C Datasheet Download


XC6VLX365T-L1FFG1759C Overview



The XC6VLX365T-L1FFG1759C chip model is a high-performance and low-power FPGA designed to provide a cost-effective solution for many applications. It is a FPGA with a powerful 6-layer logic architecture and a wide variety of features, such as high-speed transceivers, high-speed I/O, and powerful embedded processors. It is designed to meet the needs of a wide range of applications, including embedded computing, industrial control, and communications.


The XC6VLX365T-L1FFG1759C chip model has been widely used in various network and intelligent scenarios. It has been adopted by many leading companies in the industry for its high performance, low power consumption, and cost-effectiveness. It is also a great choice for the era of fully intelligent systems, as it can provide a cost-effective solution for a variety of intelligent applications.


In terms of industry trends, the XC6VLX365T-L1FFG1759C chip model is becoming increasingly popular, as it is a powerful and cost-effective solution for many applications. It is also becoming increasingly important in the era of intelligent systems, as it can provide a cost-effective solution for a variety of intelligent applications.


When using the XC6VLX365T-L1FFG1759C chip model, it is important to consider its product description and design requirements. The product description should include the features, performance, and power consumption of the chip model. The design requirements should include the specific requirements of the application, such as the number of transceivers, the number of I/O pins, and the number of embedded processors. It is also important to consider the actual case studies of the chip model, as this will help to ensure that the application is using the right chip model for the right application. Finally, it is important to consider the precautions when using the chip model, such as proper cooling, proper power management, and proper testing.


In conclusion, the XC6VLX365T-L1FFG1759C chip model is a powerful and cost-effective solution for many applications. It is becoming increasingly important in the era of intelligent systems, as it can provide a cost-effective solution for a variety of intelligent applications. It is important to consider the product description and design requirements, as well as the actual case studies and precautions when using the chip model.



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