AMD Xilinx
XC6VLX365T-3FFG1759C
XC6VLX365T-3FFG1759C ECAD Model
XC6VLX365T-3FFG1759C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 364032 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.412 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| JESD-30 Code | S-PBGA-B | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | |
| Pin Count | 1759 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VLX365T-3FFG1759C Datasheet Download
XC6VLX365T-3FFG1759C Overview
The XC6VLX365T-3FFG1759C chip model is a powerful, high-performance, low-power FPGA chip developed by Xilinx, Inc. that is designed to meet the needs of today's advanced communication systems. It is a multi-function, multi-purpose device that can be used in a variety of applications, including digital signal processing, high-speed networking, and embedded systems.
The original design intention of the XC6VLX365T-3FFG1759C was to provide a cost-effective, low-power solution for advanced communication systems. Its features include a high-speed, low-power, and low-cost design that allows for the development of high-performance systems. It has a wide range of capabilities, including high-speed networking, digital signal processing, and embedded systems.
The XC6VLX365T-3FFG1759C is also designed to be upgradable, allowing for future improvements and upgrades. This chip model is capable of supporting the latest communication technologies, including 5G, Wi-Fi, and Bluetooth. It is also capable of supporting the latest intelligent technologies, such as artificial intelligence, machine learning, and natural language processing.
The XC6VLX365T-3FFG1759C can be used in a variety of networks and intelligent scenarios, including autonomous vehicles, smart home systems, and robotics. It is also capable of being used in the development and popularization of future intelligent robots. To use the XC6VLX365T-3FFG1759C effectively, technical talents such as software engineers, hardware engineers, and computer scientists are needed.
In conclusion, the XC6VLX365T-3FFG1759C is a powerful, high-performance, low-power FPGA chip designed to meet the needs of today's advanced communication systems. It is designed to be upgradable and can be used in a variety of networks and intelligent scenarios. It is also capable of being used in the development and popularization of future intelligent robots, and technical talents such as software engineers, hardware engineers, and computer scientists are needed to use the model effectively.
You May Also Be Interested In
4,720 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,359.6317 | $4,359.6317 |
| 10+ | $4,312.7539 | $43,127.5392 |
| 100+ | $4,078.3651 | $407,836.5120 |
| 1000+ | $3,843.9763 | $1,921,988.1600 |
| 10000+ | $3,515.8320 | $3,515,832.0000 |
| The price is for reference only, please refer to the actual quotation! | ||