AMD Xilinx
XC6VHX565T-2FFG1923I
XC6VHX565T-2FFG1923I ECAD Model
XC6VHX565T-2FFG1923I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 566784 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1923 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1923 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1923,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 45 X 45 MM, LEAD FREE, FBGA-1923 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 1923 |
XC6VHX565T-2FFG1923I Datasheet Download
XC6VHX565T-2FFG1923I Overview
The XC6VHX565T-2FFG1923I model chip is a high-performance, low-power, field-programmable gate array (FPGA) designed by Xilinx. It is suitable for high-performance digital signal processing, embedded processing, image processing and other applications that require the use of HDL language. It is a popular choice for many industries due to its low power consumption and high performance.
The XC6VHX565T-2FFG1923I model chip has many advantages. It has a very low power consumption, and the power consumption can be further reduced by using dynamic power management. It also has a high level of scalability, meaning that it can be easily upgraded and expanded to meet the needs of the customer. The chip also has a high level of integration, meaning that it can be used to combine multiple functions into one chip, thus reducing the overall cost of the system.
The demand for the XC6VHX565T-2FFG1923I model chip is expected to increase in the future, as the need for high-performance digital signal processing, embedded processing, image processing and other applications grows. This is due to the increasing demand for intelligent systems and the need for advanced technologies. As the demand for intelligent systems grows, the need for the XC6VHX565T-2FFG1923I model chip will also increase.
The XC6VHX565T-2FFG1923I model chip can be applied to the development and popularization of future intelligent robots. It has the ability to process large amounts of data quickly and accurately, making it an ideal choice for use in robotics. To effectively use the XC6VHX565T-2FFG1923I model chip, technical talents with knowledge of HDL language, digital signal processing, embedded processing, image processing and other related technologies are required. In addition, knowledge of robotics and artificial intelligence is also beneficial.
In conclusion, the XC6VHX565T-2FFG1923I model chip is a powerful, low-power, field-programmable gate array (FPGA) that is suitable for high-performance digital signal processing, embedded processing, image processing and other applications that require the use of HDL language. Its low power consumption and high performance make it a popular choice for many industries. The demand for the XC6VHX565T-2FFG1923I model chip is expected to increase in the future, and it can be applied to the development and popularization of future intelligent robots. Technical talents with knowledge of HDL language, digital signal processing, embedded processing, image processing and other related technologies are required to effectively use the model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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