XC6VHX255T-1FFG1923I
XC6VHX255T-1FFG1923I
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rohs

AMD Xilinx

XC6VHX255T-1FFG1923I


XC6VHX255T-1FFG1923I
F20-XC6VHX255T-1FFG1923I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 45 X 45 MM, LEAD FREE, FBGA-1923
45 X 45 MM, LEAD FREE, FBGA-1923

XC6VHX255T-1FFG1923I ECAD Model


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XC6VHX255T-1FFG1923I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 480
Number of Outputs 480
Number of Logic Cells 253440
Combinatorial Delay of a CLB-Max 5.08 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1923
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1923
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1923,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 3.85 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 45 X 45 MM, LEAD FREE, FBGA-1923
Pin Count 1923
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6VHX255T-1FFG1923I Datasheet Download


XC6VHX255T-1FFG1923I Overview



The chip model XC6VHX255T-1FFG1923I is a new generation of chip model from FPGA company Xilinx. It is designed to provide a comprehensive solution for high-end communication systems. This chip model has been designed with the latest technologies and features to meet the needs of the current industry.


The XC6VHX255T-1FFG1923I is designed to provide the highest performance, reliability, and scalability for advanced communication systems. It is based on a Xilinx Virtex-6 FPGA, and has a wide range of features including high-speed transceivers, high-speed I/O, high-speed memory, and high-speed logic. This chip model also has a range of advanced features such as a multi-channel data converter, a multi-channel clock generator, and a multi-channel clock distribution network.


In terms of industry trends, the XC6VHX255T-1FFG1923I is expected to be widely used in the future. It is designed to provide a comprehensive solution for high-end communication systems, and its features are expected to be increasingly in demand in the future. Furthermore, this chip model is expected to be a key component in advanced communication systems, and its features will be required in order to support new technologies.


The original design intention of the XC6VHX255T-1FFG1923I is to provide a comprehensive solution for high-end communication systems. It is designed to provide the highest performance, reliability, and scalability for advanced communication systems. Furthermore, this chip model is also designed to be upgradable in the future, and its features can be further enhanced with future upgrades.


In terms of product description, the XC6VHX255T-1FFG1923I is a high-end chip model from FPGA company Xilinx. It is based on a Xilinx Virtex-6 FPGA, and has a wide range of features including high-speed transceivers, high-speed I/O, high-speed memory, and high-speed logic. Furthermore, this chip model also has a range of advanced features such as a multi-channel data converter, a multi-channel clock generator, and a multi-channel clock distribution network.


In terms of actual case studies and precautions, the XC6VHX255T-1FFG1923I is designed to provide a comprehensive solution for high-end communication systems. However, it is important to note that this chip model is not suitable for all applications, and it is important to consider the specific requirements of each application before making a decision. Furthermore, it is important to consider the compatibility of the chip model with existing technologies, and to ensure that the appropriate precautions are taken when using this chip model in an advanced communication system.


In conclusion, the XC6VHX255T-1FFG1923I is a high-end chip model from FPGA company Xilinx. It is designed to provide a comprehensive solution for high-end communication systems, and its features are expected to be increasingly in demand in the future. Furthermore, this chip model is also designed to be upgradable in the future, and its features can be further enhanced with future upgrades. In terms of actual case studies and precautions, it is important to consider the specific requirements of each application before making a decision, and to ensure that the appropriate precautions are taken when using this chip model in an advanced communication system.



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Unit Price: $3,430.224
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QTY Unit Price Ext Price
1+ $3,190.1083 $3,190.1083
10+ $3,155.8061 $31,558.0608
100+ $2,984.2949 $298,429.4880
1000+ $2,812.7837 $1,406,391.8400
10000+ $2,572.6680 $2,572,668.0000
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