
AMD Xilinx
XC6VHX255T-1FFG1923I
XC6VHX255T-1FFG1923I ECAD Model
XC6VHX255T-1FFG1923I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 480 | |
Number of Outputs | 480 | |
Number of Logic Cells | 253440 | |
Combinatorial Delay of a CLB-Max | 5.08 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1923 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1923 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1923,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.85 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 45 X 45 MM, LEAD FREE, FBGA-1923 | |
Pin Count | 1923 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC6VHX255T-1FFG1923I Datasheet Download
XC6VHX255T-1FFG1923I Overview
The chip model XC6VHX255T-1FFG1923I is a new generation of chip model from FPGA company Xilinx. It is designed to provide a comprehensive solution for high-end communication systems. This chip model has been designed with the latest technologies and features to meet the needs of the current industry.
The XC6VHX255T-1FFG1923I is designed to provide the highest performance, reliability, and scalability for advanced communication systems. It is based on a Xilinx Virtex-6 FPGA, and has a wide range of features including high-speed transceivers, high-speed I/O, high-speed memory, and high-speed logic. This chip model also has a range of advanced features such as a multi-channel data converter, a multi-channel clock generator, and a multi-channel clock distribution network.
In terms of industry trends, the XC6VHX255T-1FFG1923I is expected to be widely used in the future. It is designed to provide a comprehensive solution for high-end communication systems, and its features are expected to be increasingly in demand in the future. Furthermore, this chip model is expected to be a key component in advanced communication systems, and its features will be required in order to support new technologies.
The original design intention of the XC6VHX255T-1FFG1923I is to provide a comprehensive solution for high-end communication systems. It is designed to provide the highest performance, reliability, and scalability for advanced communication systems. Furthermore, this chip model is also designed to be upgradable in the future, and its features can be further enhanced with future upgrades.
In terms of product description, the XC6VHX255T-1FFG1923I is a high-end chip model from FPGA company Xilinx. It is based on a Xilinx Virtex-6 FPGA, and has a wide range of features including high-speed transceivers, high-speed I/O, high-speed memory, and high-speed logic. Furthermore, this chip model also has a range of advanced features such as a multi-channel data converter, a multi-channel clock generator, and a multi-channel clock distribution network.
In terms of actual case studies and precautions, the XC6VHX255T-1FFG1923I is designed to provide a comprehensive solution for high-end communication systems. However, it is important to note that this chip model is not suitable for all applications, and it is important to consider the specific requirements of each application before making a decision. Furthermore, it is important to consider the compatibility of the chip model with existing technologies, and to ensure that the appropriate precautions are taken when using this chip model in an advanced communication system.
In conclusion, the XC6VHX255T-1FFG1923I is a high-end chip model from FPGA company Xilinx. It is designed to provide a comprehensive solution for high-end communication systems, and its features are expected to be increasingly in demand in the future. Furthermore, this chip model is also designed to be upgradable in the future, and its features can be further enhanced with future upgrades. In terms of actual case studies and precautions, it is important to consider the specific requirements of each application before making a decision, and to ensure that the appropriate precautions are taken when using this chip model in an advanced communication system.
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4,943 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,190.1083 | $3,190.1083 |
10+ | $3,155.8061 | $31,558.0608 |
100+ | $2,984.2949 | $298,429.4880 |
1000+ | $2,812.7837 | $1,406,391.8400 |
10000+ | $2,572.6680 | $2,572,668.0000 |
The price is for reference only, please refer to the actual quotation! |