AMD Xilinx
XC6VHX380T-1FFG1923I
XC6VHX380T-1FFG1923I ECAD Model
XC6VHX380T-1FFG1923I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 382464 | |
| Combinatorial Delay of a CLB-Max | 5.08 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1923 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1923 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1923,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 45 X 45 MM, LEAD FREE, FBGA-1923 | |
| Pin Count | 1923 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VHX380T-1FFG1923I Datasheet Download
XC6VHX380T-1FFG1923I Overview
The XC6VHX380T-1FFG1923I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It enables users to quickly and accurately perform complex tasks with its high-performance capabilities. It is designed to be flexible, allowing for future upgrades, and its original design intention was to provide users with a reliable and efficient solution.
The chip model XC6VHX380T-1FFG1923I is capable of being applied to advanced communication systems, such as networks and intelligent scenarios. The chip model is designed to be robust and reliable, and can be used in the era of fully intelligent systems. It can be used to create intelligent systems that are capable of quickly and accurately processing data, as well as providing reliable and efficient solutions.
The XC6VHX380T-1FFG1923I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be flexible and can be used to create intelligent systems that are capable of quickly and accurately processing data. It is also capable of being applied to advanced communication systems, such as networks and intelligent scenarios. The chip model is designed to be robust and reliable, and can be used in the era of fully intelligent systems. With its high-performance capabilities, it is the perfect choice for those looking for a reliable and efficient solution.
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4,708 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,975.9598 | $6,975.9598 |
| 10+ | $6,900.9494 | $69,009.4944 |
| 100+ | $6,525.8978 | $652,589.7840 |
| 1000+ | $6,150.8462 | $3,075,423.1200 |
| 10000+ | $5,625.7740 | $5,625,774.0000 |
| The price is for reference only, please refer to the actual quotation! | ||