AMD Xilinx
XC6VHX565T-1FFG1923I
XC6VHX565T-1FFG1923I ECAD Model
XC6VHX565T-1FFG1923I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 566784 | |
| Combinatorial Delay of a CLB-Max | 5.08 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1923 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1923 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1923,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 45 X 45 MM, LEAD FREE, FBGA-1923 | |
| Pin Count | 1923 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.B | |
| HTS Code | 8542.39.00.01 |
XC6VHX565T-1FFG1923I Datasheet Download
XC6VHX565T-1FFG1923I Overview
The chip model XC6VHX565T-1FFG1923I is a new generation of integrated circuit technology developed by the leading semiconductor manufacturer in the industry. It is an advanced system-on-chip (SoC) solution for high-performance applications. This model is designed to provide superior performance and power efficiency for a wide range of applications, including communications, computing, and consumer electronics.
The XC6VHX565T-1FFG1923I chip model is equipped with advanced features such as high-speed memory, advanced digital signal processing, and high-speed serial communication. It also offers a wide range of system-level integration, including multiple cores, high-speed memory interfaces, and multiple I/O ports. This model is designed to meet the needs of the most demanding applications, while providing the highest levels of performance and power efficiency.
The XC6VHX565T-1FFG1923I chip model is expected to be in high demand in the future, especially in the communications, computing, and consumer electronics industries. With its advanced features, it is ideal for use in applications such as 5G, Wi-Fi, and LTE networks, as well as in the development of smart home and IoT devices. This model is also well-suited for use in the development of advanced communication systems, as it offers high-speed serial communication and multiple I/O ports.
The original design intention of the XC6VHX565T-1FFG1923I chip model was to provide superior performance and power efficiency for a wide range of applications. The possibility for future upgrades is also high, as the model is designed to be highly scalable and customizable. Additionally, this model can be used in the development and popularization of future intelligent robots, as it is equipped with advanced features such as high-speed memory, digital signal processing, and multiple I/O ports.
To use the XC6VHX565T-1FFG1923I chip model effectively, technical personnel with expertise in embedded systems, digital signal processing, and communications are required. Additionally, personnel with knowledge of programming languages such as C, C++, and Python are also necessary for the development and deployment of applications for this model.
In conclusion, the XC6VHX565T-1FFG1923I chip model is a powerful and versatile SoC solution for high-performance applications. It is expected to be in high demand in the future, and its advanced features make it ideal for use in the development of advanced communication systems, smart home and IoT devices, and intelligent robots. To use the model effectively, technical personnel with expertise in embedded systems, digital signal processing, and communications are required.
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1,406 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7,120.5487 | $7,120.5487 |
| 10+ | $7,043.9837 | $70,439.8368 |
| 100+ | $6,661.1585 | $666,115.8480 |
| 1000+ | $6,278.3333 | $3,139,166.6400 |
| 10000+ | $5,742.3780 | $5,742,378.0000 |
| The price is for reference only, please refer to the actual quotation! | ||