AMD Xilinx
XC6VHX255T-2FFG1923I
XC6VHX255T-2FFG1923I ECAD Model
XC6VHX255T-2FFG1923I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 253440 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1923 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1923 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1923,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 45 X 45 MM, LEAD FREE, FBGA-1923 | |
| Pin Count | 1923 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.B | |
| HTS Code | 8542.39.00.01 |
XC6VHX255T-2FFG1923I Datasheet Download
XC6VHX255T-2FFG1923I Overview
The XC6VHX255T-2FFG1923I chip model is a cutting-edge technology developed by Xilinx. It is designed to provide the highest levels of performance, reliability, and scalability for advanced communication systems. This chip has a wide range of applications, making it an ideal choice for a variety of projects.
The XC6VHX255T-2FFG1923I chip model is based on Xilinx's Virtex-6 FPGA architecture, which provides a high-performance, low-power solution for a variety of applications. The chip model features an array of configurable logic blocks, embedded memory blocks, and powerful DSP blocks, making it suitable for a wide range of applications. It also has a high-speed serial transceiver, allowing for high-speed data transfer.
The original design intention of the XC6VHX255T-2FFG1923I chip model was to provide a reliable, high-performance solution for advanced communication systems. However, it also has the potential for future upgrades, making it a viable option for a variety of other applications. For example, the chip model can be used for the development and popularization of future intelligent robots, making it an ideal choice for those looking to create a powerful, yet cost-effective solution.
When it comes to using the XC6VHX255T-2FFG1923I chip model effectively, certain technical talents are required. For example, those who are familiar with FPGA programming and have a good understanding of digital design principles will be able to get the most out of the chip. Additionally, those with experience in embedded systems and digital signal processing will be able to take full advantage of the chip's powerful features.
In order to ensure that the XC6VHX255T-2FFG1923I chip model is used effectively, it is important to consider the product description and specific design requirements. Additionally, actual case studies and precautions should be taken into account, as these can help to ensure that the chip is used in the most optimal manner.
Overall, the XC6VHX255T-2FFG1923I chip model is an ideal choice for a variety of applications, from advanced communication systems to the development and popularization of future intelligent robots. It is a powerful, yet cost-effective solution, and those with the necessary technical talents will be able to get the most out of the chip. When considering the chip model, it is important to take into account the product description and design requirements, as well as actual case studies and precautions.
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2,014 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,987.1778 | $3,987.1778 |
| 10+ | $3,944.3050 | $39,443.0496 |
| 100+ | $3,729.9406 | $372,994.0560 |
| 1000+ | $3,515.5762 | $1,757,788.0800 |
| 10000+ | $3,215.4660 | $3,215,466.0000 |
| The price is for reference only, please refer to the actual quotation! | ||