AMD Xilinx
XC6VHX565T-1FFG1923C
XC6VHX565T-1FFG1923C ECAD Model
XC6VHX565T-1FFG1923C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 566784 | |
| Combinatorial Delay of a CLB-Max | 5.08 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1923 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1923 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1923,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 45 X 45 MM, LEAD FREE, FBGA-1923 | |
| Pin Count | 1923 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.B | |
| HTS Code | 8542.39.00.01 |
XC6VHX565T-1FFG1923C Datasheet Download
XC6VHX565T-1FFG1923C Overview
The XC6VHX565T-1FFG1923C chip model is a powerful digital signal processor that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language for its programming.
The XC6VHX565T-1FFG1923C chip model has become increasingly popular in recent years due to its performance and flexibility. It is used in a variety of industries, from medical to automotive, and is becoming an essential component in the development of modern technologies.
The future of the XC6VHX565T-1FFG1923C chip model is highly dependent on the development of new technologies and the demand for them in the industry. It is likely that the chip model will be used in networks and intelligent scenarios, as well as in fully intelligent systems. This will require the support of new technologies, such as artificial intelligence and machine learning, in order to be effective.
The XC6VHX565T-1FFG1923C chip model is highly versatile and can be used in a variety of applications. Its future development and use in the industry will depend on the demand for new technologies and the development of those technologies. With the advancement of technology, the chip model is likely to become an integral part of the development of new intelligent systems and networks.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||