XC6VHX255T-1FFG1923C
XC6VHX255T-1FFG1923C
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rohs

AMD Xilinx

XC6VHX255T-1FFG1923C


XC6VHX255T-1FFG1923C
F20-XC6VHX255T-1FFG1923C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 45 X 45 MM, LEAD FREE, FBGA-1923
45 X 45 MM, LEAD FREE, FBGA-1923

XC6VHX255T-1FFG1923C ECAD Model


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XC6VHX255T-1FFG1923C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 480
Number of Outputs 480
Number of Logic Cells 253440
Combinatorial Delay of a CLB-Max 5.08 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1923
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1923
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1923,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 3.85 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 45 X 45 MM, LEAD FREE, FBGA-1923
Pin Count 1923
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6VHX255T-1FFG1923C Datasheet Download


XC6VHX255T-1FFG1923C Overview



The XC6VHX255T-1FFG1923C chip model is a powerful and versatile model that offers a variety of advantages for a variety of applications. It is a 6th generation FPGA that is designed for high-speed, high-performance applications. This chip model has a wide range of features, including high-speed I/O, high-bandwidth memory controller, and integrated DSP blocks. Its advanced design and architecture make it suitable for a variety of applications, such as networking, data processing, and multimedia.


The XC6VHX255T-1FFG1923C chip model is expected to see an increasing demand in the future, as the need for more efficient and reliable solutions continues to grow. With its high-speed I/O, high-bandwidth memory controller, and integrated DSP blocks, the chip model is well-suited for a variety of network applications. It can be used to build high-performance networks that are capable of handling large amounts of data. It can also be used to create intelligent networks that can automatically detect and respond to changes in the environment.


The XC6VHX255T-1FFG1923C chip model is also well-suited for intelligent scenarios such as machine learning and artificial intelligence. With its advanced design and architecture, the chip model can be used to create intelligent systems that can process large amounts of data and make decisions based on the data. It can also be used in the era of fully intelligent systems, where machines are able to make decisions without any human intervention.


The XC6VHX255T-1FFG1923C chip model has a number of specific design requirements that must be met in order to ensure its optimal performance. The chip model must be designed with a high-speed I/O, high-bandwidth memory controller, and integrated DSP blocks. It must also be designed with a low power consumption and a high level of reliability. In addition, the chip model must be designed to be compatible with a variety of operating systems and software.


To get a better understanding of the XC6VHX255T-1FFG1923C chip model, it is important to look at case studies and actual applications. For example, the chip model has been used in a variety of networks, including a high-performance, low-latency network for a large financial institution. In addition, the chip model has been used in a number of intelligent scenarios, such as a machine learning system for a healthcare company.


When using the XC6VHX255T-1FFG1923C chip model, it is important to follow certain precautions. For example, the chip model should be used in a well-ventilated environment, as it can generate a lot of heat. It is also important to make sure that the chip model is properly configured and that the software is up-to-date. Finally, it is important to make sure that the chip model is properly tested before it is deployed in a production environment.



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