
AMD Xilinx
XC6VHX255T-1FFG1923C
XC6VHX255T-1FFG1923C ECAD Model
XC6VHX255T-1FFG1923C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 480 | |
Number of Outputs | 480 | |
Number of Logic Cells | 253440 | |
Combinatorial Delay of a CLB-Max | 5.08 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1923 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1923 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1923,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.85 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 45 X 45 MM, LEAD FREE, FBGA-1923 | |
Pin Count | 1923 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC6VHX255T-1FFG1923C Datasheet Download
XC6VHX255T-1FFG1923C Overview
The XC6VHX255T-1FFG1923C chip model is a powerful and versatile model that offers a variety of advantages for a variety of applications. It is a 6th generation FPGA that is designed for high-speed, high-performance applications. This chip model has a wide range of features, including high-speed I/O, high-bandwidth memory controller, and integrated DSP blocks. Its advanced design and architecture make it suitable for a variety of applications, such as networking, data processing, and multimedia.
The XC6VHX255T-1FFG1923C chip model is expected to see an increasing demand in the future, as the need for more efficient and reliable solutions continues to grow. With its high-speed I/O, high-bandwidth memory controller, and integrated DSP blocks, the chip model is well-suited for a variety of network applications. It can be used to build high-performance networks that are capable of handling large amounts of data. It can also be used to create intelligent networks that can automatically detect and respond to changes in the environment.
The XC6VHX255T-1FFG1923C chip model is also well-suited for intelligent scenarios such as machine learning and artificial intelligence. With its advanced design and architecture, the chip model can be used to create intelligent systems that can process large amounts of data and make decisions based on the data. It can also be used in the era of fully intelligent systems, where machines are able to make decisions without any human intervention.
The XC6VHX255T-1FFG1923C chip model has a number of specific design requirements that must be met in order to ensure its optimal performance. The chip model must be designed with a high-speed I/O, high-bandwidth memory controller, and integrated DSP blocks. It must also be designed with a low power consumption and a high level of reliability. In addition, the chip model must be designed to be compatible with a variety of operating systems and software.
To get a better understanding of the XC6VHX255T-1FFG1923C chip model, it is important to look at case studies and actual applications. For example, the chip model has been used in a variety of networks, including a high-performance, low-latency network for a large financial institution. In addition, the chip model has been used in a number of intelligent scenarios, such as a machine learning system for a healthcare company.
When using the XC6VHX255T-1FFG1923C chip model, it is important to follow certain precautions. For example, the chip model should be used in a well-ventilated environment, as it can generate a lot of heat. It is also important to make sure that the chip model is properly configured and that the software is up-to-date. Finally, it is important to make sure that the chip model is properly tested before it is deployed in a production environment.
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