
AMD Xilinx
XC2V80-6CS144I
XC2V80-6CS144I ECAD Model
XC2V80-6CS144I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 92 | |
Number of Outputs | 92 | |
Number of Logic Cells | 1152 | |
Number of Equivalent Gates | 80000 | |
Number of CLBs | 128 | |
Combinatorial Delay of a CLB-Max | 350 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 128 CLBS, 80000 GATES | |
Clock Frequency-Max | 820 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 240 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA144,13X13,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Width | 12 mm | |
Length | 12 mm | |
Seated Height-Max | 1.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144 | |
Pin Count | 144 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2V80-6CS144I Datasheet Download
XC2V80-6CS144I Overview
The XC2V80-6CS144I chip model is a high-performance integrated circuit that has been developed to meet the needs of modern industries. It is capable of providing a variety of features, including high-speed communication, low-power consumption, and high-density integration. With its advanced features, the XC2V80-6CS144I chip model is expected to become increasingly popular in the near future.
The XC2V80-6CS144I chip model is designed with a 6-layer architecture, which is capable of supporting a wide range of applications. It has an integrated power supply, which is capable of providing power to the various components of the chip. The chip also has an integrated clock, which is used to synchronize the various components of the chip. The chip also has a wide range of digital input/output (I/O) ports, which are used to connect the various components of the chip. The chip also has a wide range of analog input/output (A/O) ports, which are used to connect the various components of the chip.
The XC2V80-6CS144I chip model is designed to be used in a variety of applications. It is capable of providing high-speed communication, low-power consumption, and high-density integration. This makes it ideal for use in a wide range of industries, such as automotive, medical, and industrial applications. In addition, the chip is also capable of providing support for a wide range of wireless technologies, such as Bluetooth, Wi-Fi, and Zigbee.
In order to use the XC2V80-6CS144I chip model effectively, it is important to understand the product description and design requirements. It is also important to understand the actual case studies and precautions associated with using the chip. For example, it is important to ensure that the chip is properly powered, and that all of the components are connected properly. It is also important to ensure that the chip is properly programmed and configured, and that the chip is properly tested and verified.
The XC2V80-6CS144I chip model is capable of being used in the development and popularization of future intelligent robots. This is due to its high-speed communication, low-power consumption, and high-density integration. In order to use the chip effectively, it is important to have a good understanding of the product description and design requirements, as well as the actual case studies and precautions associated with using the chip. Additionally, it is important to have a good understanding of the various technologies involved in the development and popularization of intelligent robots, such as artificial intelligence, machine learning, and natural language processing. Technical talents such as software engineers, hardware engineers, and roboticists are also needed in order to use the XC2V80-6CS144I chip model effectively.
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