AMD Xilinx
XC2V80-4CS144C
XC2V80-4CS144C ECAD Model
XC2V80-4CS144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 92 | |
| Number of Logic Cells | 1152 | |
| Number of Equivalent Gates | 80000 | |
| Number of CLBs | 128 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 128 CLBS, 80000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2V80-4CS144C Datasheet Download
XC2V80-4CS144C Overview
The Xilinx XC2V80-4CS144C is a powerful FPGA chip model, designed to meet the needs of today’s rapidly evolving technology. It is a member of the Virtex-II family of FPGA chips, and is designed to be highly scalable, allowing for future upgrades and expansions. This chip is capable of handling a wide range of tasks, from simple logic to complex high-speed communication systems.
The XC2V80-4CS144C can be used in a variety of network applications, from small-scale local area networks to large-scale wide area networks. It is also suitable for use in intelligent scenarios such as artificial intelligence, machine learning, and natural language processing. This chip can be used to develop and deploy intelligent robots, and is capable of performing complex tasks with minimal programming.
The XC2V80-4CS144C is a powerful and versatile chip, but it requires a certain level of technical knowledge and expertise to use it effectively. It is important to understand the chip’s architecture and capabilities, as well as the development environment, in order to make the most of its features. The chip is designed to be highly scalable, allowing for future upgrades and expansions, so it is possible to use it in the era of fully intelligent systems.
In conclusion, the Xilinx XC2V80-4CS144C is a powerful FPGA chip model, designed to meet the needs of today’s rapidly evolving technology. It is capable of handling a wide range of tasks, from simple logic to complex high-speed communication systems. It can be used in a variety of network applications, from small-scale local area networks to large-scale wide area networks. It is also suitable for use in intelligent scenarios such as artificial intelligence, machine learning, and natural language processing. With the right technical knowledge and expertise, the XC2V80-4CS144C can be used to develop and deploy intelligent robots, and is capable of performing complex tasks with minimal programming.
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|---|---|---|
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