AMD Xilinx
XC2V80-5CS144C
XC2V80-5CS144C ECAD Model
XC2V80-5CS144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 92 | |
| Number of Logic Cells | 1152 | |
| Number of Equivalent Gates | 80000 | |
| Number of CLBs | 128 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 128 CLBS, 80000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2V80-5CS144C Datasheet Download
XC2V80-5CS144C Overview
The chip model XC2V80-5CS144C is a powerful integrated circuit designed for a variety of applications. It is a versatile and reliable solution for a wide range of projects and can be used in a wide variety of devices. It is designed to provide high performance and low power consumption, making it an ideal choice for many applications.
The XC2V80-5CS144C chip model is designed to be compatible with a variety of technologies and can be easily integrated into existing systems. It is a highly efficient device and can be used to reduce power consumption and improve system performance. It is also designed to support a wide range of communication protocols and can be used to build high-speed networks.
The XC2V80-5CS144C chip model is also designed to be upgradeable, allowing it to be used in new and advanced applications. It is also capable of being used in advanced communication systems, such as 5G networks and beyond. It is also capable of being used in intelligent systems and can be used to create intelligent scenarios.
In the future, the XC2V80-5CS144C chip model can be used in a variety of applications, including advanced communication networks, intelligent systems, and more. It is capable of providing high performance and low power consumption, making it an ideal choice for many applications. With its versatile design and reliable performance, the XC2V80-5CS144C chip model is an excellent choice for many projects and can help to improve system performance and reduce power consumption.
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|---|---|---|
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