AMD Xilinx
XC2V80-4CS144I
XC2V80-4CS144I ECAD Model
XC2V80-4CS144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 92 | |
| Number of Logic Cells | 1152 | |
| Number of Equivalent Gates | 80000 | |
| Number of CLBs | 128 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 128 CLBS, 80000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2V80-4CS144I Datasheet Download
XC2V80-4CS144I Overview
The chip model XC2V80-4CS144I is a powerful and versatile device that is becoming increasingly popular in the tech industry. It is a member of the Xilinx Spartan-II family of Field Programmable Gate Arrays (FPGAs) and is designed to provide high-performance and low-cost solutions. This chip model is ideal for applications that require high-speed signal processing, logic synthesis, and embedded control.
The XC2V80-4CS144I chip model has a wide range of applications in the tech industry. It can be used in a variety of networks, from industrial automation systems to consumer electronics. It is also suitable for use in intelligent systems, such as artificial intelligence (AI) and machine learning (ML) applications. The chip model has the ability to process large amounts of data quickly, making it an ideal choice for applications that require high-speed processing and efficient data storage.
The XC2V80-4CS144I chip model has a number of features that make it an attractive choice for many applications. It has a high-speed architecture that allows for fast data processing, as well as a low power consumption design that makes it suitable for use in battery-powered devices. The chip model also provides a high level of flexibility, allowing for the integration of various components and technologies.
In order to ensure the successful implementation of the XC2V80-4CS144I chip model, it is important to consider the product description and specific design requirements. The chip model's features and capabilities should be taken into account when designing the application. It is also important to consider the environment in which the chip model will be used, as this will determine the type of technologies that will be required.
Case studies of applications that have used the XC2V80-4CS144I chip model can provide valuable insight into the potential of this device. In addition, it is important to consider any potential risks associated with the use of the chip model and to take the necessary precautions to ensure its safe and successful implementation.
In conclusion, the XC2V80-4CS144I chip model is an extremely versatile and powerful device that is becoming increasingly popular in the tech industry. It is suitable for a wide range of applications, from industrial automation systems to consumer electronics and intelligent systems. In order to ensure its successful implementation, it is important to consider the product description and specific design requirements, as well as any potential risks associated with the use of the chip model.
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