AMD Xilinx
XC2V80-5CS144I
XC2V80-5CS144I ECAD Model
XC2V80-5CS144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 92 | |
| Number of Logic Cells | 1152 | |
| Number of Equivalent Gates | 80000 | |
| Number of CLBs | 128 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 128 CLBS, 80000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2V80-5CS144I Datasheet Download
XC2V80-5CS144I Overview
The chip model XC2V80-5CS144I is an innovative product developed by Xilinx, a leader in the field of programmable logic devices. It is a field-programmable gate array (FPGA) designed for high-speed, low-power applications. The device is based on Xilinx's Virtex-II Pro technology, which combines the flexibility of FPGAs with the performance of ASICs. It is suitable for applications such as digital signal processing, embedded systems, communication systems, and intelligent robots.
The XC2V80-5CS144I has many advantages, such as high performance, low power consumption, and high density. It also has a wide range of features, including embedded multipliers, high-speed I/O, and dedicated memory blocks. The device is also suitable for use in advanced communication systems, such as 5G, Wi-Fi, and Bluetooth. It is capable of supporting high-speed data transmission and can be used for applications such as streaming video and audio.
In terms of the future development of the chip model XC2V80-5CS144I, it is expected that new technologies will be needed to meet the requirements of the application environment. For example, the device may need to support new communication protocols, such as 5G, or advanced algorithms for intelligent robots. In addition, it is also possible that the device could be upgraded in the future to support more advanced features.
The chip model XC2V80-5CS144I can also be applied to the development and popularization of future intelligent robots. It is capable of supporting the high-speed data transmission needed for the robots to move and interact with their environment. In order to use the model effectively, technical talents such as software engineers, hardware engineers, and AI experts are needed.
In conclusion, the chip model XC2V80-5CS144I is a powerful and versatile device that can be used for a variety of applications, including advanced communication systems and intelligent robots. In order to make the most of the device, new technologies and technical talents will be needed in the future.
You May Also Be Interested In
5,779 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||