AMD Xilinx
XC2V6000-6BFG957I
XC2V6000-6BFG957I ECAD Model
XC2V6000-6BFG957I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 6000000 | |
| Number of CLBs | 8448 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8448 CLBS, 6000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V6000-6BFG957I Datasheet Download
XC2V6000-6BFG957I Overview
The chip model XC2V6000-6BFG957I has been designed to meet the growing demand for high-performance digital signal processing, embedded processing, and image processing. It is a powerful tool for those looking to break into the world of digital signal processing. The chip model is built with the latest technologies and is capable of meeting the most demanding requirements.
The chip model XC2V6000-6BFG957I is designed to be compatible with the latest HDL language, making it a great choice for those looking to get into the world of digital signal processing. The chip model also supports the latest technologies, making it an ideal choice for those looking to get into the world of embedded processing and image processing.
The chip model XC2V6000-6BFG957I is designed with the future in mind. It is designed to be able to handle the most demanding requirements, and is capable of being upgraded in the future. This means that the chip model can be used for the most advanced communication systems, as well as for the most basic ones.
The original design intention of the chip model XC2V6000-6BFG957I was to create a powerful tool that could handle the most demanding requirements. It was designed to be able to handle the latest technologies, and to be upgradeable in the future. This means that the chip model can be used for the most advanced communication systems, as well as for the most basic ones.
The chip model XC2V6000-6BFG957I is a great choice for those looking to get into the world of digital signal processing, embedded processing, and image processing. It is designed to be compatible with the latest HDL language and is capable of meeting the most demanding requirements. It is also designed to be upgradeable in the future, meaning that it can be used for the most advanced communication systems. The chip model is a great choice for those looking to break into the world of digital signal processing, and is sure to be a great tool for those looking to get into the world of embedded processing and image processing.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||