AMD Xilinx
XC2V6000-6BF957C
XC2V6000-6BF957C ECAD Model
XC2V6000-6BF957C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 684 | |
| Number of Outputs | 684 | |
| Number of Logic Cells | 76032 | |
| Number of Equivalent Gates | 6000000 | |
| Number of CLBs | 8448 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8448 CLBS, 6000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA957,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2V6000-6BF957C Datasheet Download
XC2V6000-6BF957C Overview
The XC2V6000-6BF957C chip model has become an increasingly popular choice for many industries due to its powerful performance and reliable performance. This chip model is designed to meet the needs of a wide variety of applications, from industrial to consumer. It is a versatile, low-power, high-performance FPGA (Field Programmable Gate Array) solution with a built-in 6-bit floating-point processor.
The XC2V6000-6BF957C chip model provides a wide range of features, including high-speed data transfer, low latency, and high-performance computing. It also provides a variety of communication interfaces, including USB, Ethernet, and CAN bus. This chip model is designed to meet the needs of the most demanding applications, such as industrial automation and robotics.
The XC2V6000-6BF957C chip model is designed to be highly reliable and cost-effective. It is designed to be able to withstand harsh conditions and to be able to operate in a wide temperature range. The chip model also has built-in protection against power surges, over-voltage, and over-current. This chip model can also be used in a wide variety of applications, such as automotive, medical, and consumer electronics.
The XC2V6000-6BF957C chip model has been designed with the future in mind. It is designed to be able to support the latest technologies, such as 5G and IoT. It can be used in advanced communication systems, such as those used in autonomous vehicles and smart cities. The chip model is also designed to be upgradeable, allowing for future upgrades to meet the demands of new technologies.
In conclusion, the XC2V6000-6BF957C chip model is a powerful and reliable solution for many industries. It is designed to be able to meet the needs of a wide variety of applications, from industrial to consumer. It is also designed to be able to support the latest technologies, such as 5G and IoT, and to be upgradeable to meet the demands of new technologies. The chip model is also designed to be highly reliable and cost-effective, making it an ideal choice for many industries.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||