AMD Xilinx
XC2V6000-6BFG957C
XC2V6000-6BFG957C ECAD Model
XC2V6000-6BFG957C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 684 | |
| Number of Outputs | 684 | |
| Number of Logic Cells | 76032 | |
| Number of Equivalent Gates | 6000000 | |
| Number of CLBs | 8448 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8448 CLBS, 6000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA957,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V6000-6BFG957C Datasheet Download
XC2V6000-6BFG957C Overview
The XC2V6000-6BFG957C chip model is a versatile and powerful model designed for high-performance digital signal processing, embedded processing, and image processing. It is based on the Xilinx Virtex-II Pro FPGA architecture and is programmed using the HDL (hardware description language) language. This chip model is highly suitable for applications requiring advanced signal processing capabilities and high-speed data throughput.
The XC2V6000-6BFG957C chip model has many advantages over its competitors. It is highly efficient and consumes less power than other models, while still providing a high level of performance. It is also highly reliable, with a high MTBF (Mean Time Between Failure) rating. Additionally, the chip model can be easily integrated into existing systems and can be easily customized to meet specific needs.
In the coming years, the demand for XC2V6000-6BFG957C chip models is expected to increase significantly. This is due to the growing demand for high-performance digital signal processing, embedded processing, and image processing applications in various industries. Furthermore, the chip model is highly suitable for applications in the fields of artificial intelligence, machine learning, and autonomous systems.
The XC2V6000-6BFG957C chip model is also expected to be increasingly used in the field of networks. It can be used to provide high-speed data transmission, as well as to perform advanced signal processing tasks. Moreover, the chip model can be used to create intelligent networks and to enable the development of intelligent applications.
In the future, the XC2V6000-6BFG957C chip model is expected to be used in the era of fully intelligent systems. It can be used to enable the development of advanced machine learning algorithms, as well as to enable the development of autonomous systems. Furthermore, the chip model can be used to create intelligent networks and to enable the development of intelligent applications.
Overall, the XC2V6000-6BFG957C chip model is a versatile and powerful model designed for high-performance digital signal processing, embedded processing, and image processing. It is highly efficient, reliable, and can be easily integrated into existing systems. In the coming years, the demand for this chip model is expected to increase significantly, as it is highly suitable for applications in the fields of artificial intelligence, machine learning, and autonomous systems. In the future, it is expected to be used in the era of fully intelligent systems, enabling the development of advanced machine learning algorithms and autonomous systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||