AMD Xilinx
XC2V6000-5BFG957C
XC2V6000-5BFG957C ECAD Model
XC2V6000-5BFG957C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 684 | |
| Number of Outputs | 684 | |
| Number of Logic Cells | 76032 | |
| Number of Equivalent Gates | 6000000 | |
| Number of CLBs | 8448 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8448 CLBS, 6000000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA957,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V6000-5BFG957C Datasheet Download
XC2V6000-5BFG957C Overview
The chip model XC2V6000-5BFG957C is a type of field-programmable gate array (FPGA) developed by Xilinx. It is a high-performance device that has been widely used in various industries, such as aerospace, automotive, medical, and industrial. As the development of technology and industry continues to evolve, the chip model XC2V6000-5BFG957C is increasingly being used in more applications, such as network applications and intelligent scenarios.
In the future, the chip model XC2V6000-5BFG957C will be a core component in the development and popularization of intelligent robots. It can provide high-performance features, such as fast computing speed and low power consumption, which are necessary for the operation of robots. Additionally, the chip model XC2V6000-5BFG957C can be programmed to adapt to different environments, making it an ideal choice for the development of robots.
To use the chip model XC2V6000-5BFG957C effectively, it is important to have a good understanding of the industry trends and the future development of related industries. In addition, it is also important to have a good grasp of the technologies that are needed to support the application environment. For example, the chip model XC2V6000-5BFG957C may require the support of artificial intelligence (AI) technologies and machine learning (ML) algorithms to enable the development of intelligent robots.
In conclusion, the chip model XC2V6000-5BFG957C is a powerful device that is capable of providing high-performance features for many applications, such as networks and intelligent scenarios. It can also be used in the development and popularization of intelligent robots in the future. To use the chip model XC2V6000-5BFG957C effectively, it is important to have a good understanding of the industry trends, the future development of related industries, and the technologies that are required to support the application environment.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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