AMD Xilinx
XC2V6000-4BFG957C
XC2V6000-4BFG957C ECAD Model
XC2V6000-4BFG957C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 684 | |
| Number of Outputs | 684 | |
| Number of Logic Cells | 76032 | |
| Number of Equivalent Gates | 6000000 | |
| Number of CLBs | 8448 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8448 CLBS, 6000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA957,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V6000-4BFG957C Datasheet Download
XC2V6000-4BFG957C Overview
The XC2V6000-4BFG957C is a powerful chip model that is suitable for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language for its application. This chip is a great asset to the industry, and its future development is dependent on the specific technologies that are needed.
The chip model XC2V6000-4BFG957C can be used in a variety of networks and intelligent scenarios. It is capable of being used in the era of fully intelligent systems, as it can process complex data quickly and accurately. It also has the potential to be used in more advanced applications such as robotics, artificial intelligence, and machine learning. As these technologies continue to advance, the chip model XC2V6000-4BFG957C can be used to support these new technologies and applications.
The chip model XC2V6000-4BFG957C is a great asset to the industry and its potential applications are vast. It can be used for a wide range of applications, from digital signal processing and embedded processing to image processing and robotics. With the development of new technologies, the chip model XC2V6000-4BFG957C will be able to support them and help bring the world closer to a fully intelligent system. As the industry continues to develop, the chip model XC2V6000-4BFG957C will continue to be an important asset to the industry and its applications.
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3,977 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,418.1265 | $2,418.1265 |
| 10+ | $2,392.1251 | $23,921.2512 |
| 100+ | $2,262.1183 | $226,211.8320 |
| 1000+ | $2,132.1115 | $1,066,055.7600 |
| 10000+ | $1,950.1020 | $1,950,102.0000 |
| The price is for reference only, please refer to the actual quotation! | ||