AMD Xilinx
XC2V6000-6BF957I
XC2V6000-6BF957I ECAD Model
XC2V6000-6BF957I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 684 | |
| Number of Outputs | 684 | |
| Number of Logic Cells | 76032 | |
| Number of Equivalent Gates | 6000000 | |
| Number of CLBs | 8448 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8448 CLBS, 6000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA957,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V6000-6BF957I Datasheet Download
XC2V6000-6BF957I Overview
The chip model XC2V6000-6BF957I is an industry-leading model, developed by Xilinx to provide advanced and powerful solutions for complex tasks. It is widely used in networking and intelligent scenarios, and can be applied to different applications, such as autonomous robots, intelligent buildings, and smart homes. It is also a popular choice for research and development in the field of artificial intelligence.
As the industry evolves, the XC2V6000-6BF957I chip model is expected to remain at the forefront of technology, offering solutions for a variety of tasks. It is capable of supporting new technologies, such as deep learning and machine learning, and can be used to develop and deploy intelligent systems. This chip model is capable of providing the necessary computing power for a wide range of applications, such as autonomous vehicles, robotics, and intelligent buildings.
In order to use the XC2V6000-6BF957I chip model effectively, it is important to have a deep understanding of the technology and its capabilities. Technical expertise in the field of artificial intelligence is essential, as well as knowledge of the underlying hardware. Additionally, programming skills are also necessary to take full advantage of the chip model's capabilities.
The XC2V6000-6BF957I chip model is well-suited for the development and popularization of future intelligent robots. It is capable of providing the necessary computing power for autonomous robots, allowing them to make decisions and carry out tasks in a more efficient manner. Additionally, it can also be used to create intelligent buildings and smart homes, making them more energy-efficient and secure.
In conclusion, the XC2V6000-6BF957I chip model is a powerful and versatile solution for a variety of applications. It is capable of supporting new technologies, and can be used to develop and deploy intelligent systems. Furthermore, it is well-suited for the development and popularization of future intelligent robots, and requires technical expertise in the field of artificial intelligence as well as programming skills to take full advantage of its capabilities.
You May Also Be Interested In
3,467 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||