XC2V4000-6BFG957I
XC2V4000-6BFG957I
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rohs

AMD Xilinx

XC2V4000-6BFG957I


XC2V4000-6BFG957I
F20-XC2V4000-6BFG957I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957
40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957

XC2V4000-6BFG957I ECAD Model


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XC2V4000-6BFG957I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 684
Number of Outputs 684
Number of Logic Cells 51840
Number of Equivalent Gates 4000000
Number of CLBs 5760
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 5760 CLBS, 4000000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B957
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 957
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA957,31X31,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957
Pin Count 957
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2V4000-6BFG957I Datasheet Download


XC2V4000-6BFG957I Overview



The chip model XC2V4000-6BFG957I is a highly advanced chip model developed by Xilinx. It has been widely used in a variety of industries, such as automotive, medical, communication, and consumer electronics. It is a powerful, reliable, and cost-effective solution for many applications.


The XC2V4000-6BFG957I chip model is based on the Virtex-II Pro FPGA architecture, which provides high performance, low power consumption, and high-density logic. It also supports a wide range of communication protocols and interfaces, including USB, Ethernet, and Serial RapidIO. In addition, it provides advanced features such as high-speed DSP blocks, high-speed memory interfaces, and high-speed I/O.


The XC2V4000-6BFG957I chip model has been designed to meet the needs of a wide range of applications. It is well-suited for applications that require high performance, low power consumption, and high-density logic. It is also suitable for applications that require advanced communication protocols and interfaces.


Regarding the industry trends of the XC2V4000-6BFG957I chip model and the future development of related industries, it is expected that the demand for this model will continue to grow in the future. This is due to the increasing demand for high-performance, low-power, and high-density logic solutions. The XC2V4000-6BFG957I chip model is expected to be the preferred solution for many applications in the future.


In terms of the original design intention of the XC2V4000-6BFG957I chip model and the possibility of future upgrades, the model is designed to be highly flexible and upgradeable. It is possible to upgrade the chip model to meet the changing requirements of applications and to take advantage of new technologies. It is also possible to integrate new features and technologies into the chip model to meet the needs of advanced communication systems.


Overall, the XC2V4000-6BFG957I chip model is a highly advanced, reliable, and cost-effective solution for many applications. It is expected to continue to be in high demand in the future as the demand for high-performance, low-power, and high-density logic solutions increases. The model is also highly flexible and upgradeable, making it suitable for applications that require advanced communication protocols and interfaces and for applications that require the support of new technologies.



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