
AMD Xilinx
XC2V4000-6BFG957I
XC2V4000-6BFG957I ECAD Model
XC2V4000-6BFG957I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 684 | |
Number of Outputs | 684 | |
Number of Logic Cells | 51840 | |
Number of Equivalent Gates | 4000000 | |
Number of CLBs | 5760 | |
Combinatorial Delay of a CLB-Max | 350 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 5760 CLBS, 4000000 GATES | |
Clock Frequency-Max | 820 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B957 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 957 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA957,31X31,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
Pin Count | 957 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2V4000-6BFG957I Datasheet Download
XC2V4000-6BFG957I Overview
The chip model XC2V4000-6BFG957I is a highly advanced chip model developed by Xilinx. It has been widely used in a variety of industries, such as automotive, medical, communication, and consumer electronics. It is a powerful, reliable, and cost-effective solution for many applications.
The XC2V4000-6BFG957I chip model is based on the Virtex-II Pro FPGA architecture, which provides high performance, low power consumption, and high-density logic. It also supports a wide range of communication protocols and interfaces, including USB, Ethernet, and Serial RapidIO. In addition, it provides advanced features such as high-speed DSP blocks, high-speed memory interfaces, and high-speed I/O.
The XC2V4000-6BFG957I chip model has been designed to meet the needs of a wide range of applications. It is well-suited for applications that require high performance, low power consumption, and high-density logic. It is also suitable for applications that require advanced communication protocols and interfaces.
Regarding the industry trends of the XC2V4000-6BFG957I chip model and the future development of related industries, it is expected that the demand for this model will continue to grow in the future. This is due to the increasing demand for high-performance, low-power, and high-density logic solutions. The XC2V4000-6BFG957I chip model is expected to be the preferred solution for many applications in the future.
In terms of the original design intention of the XC2V4000-6BFG957I chip model and the possibility of future upgrades, the model is designed to be highly flexible and upgradeable. It is possible to upgrade the chip model to meet the changing requirements of applications and to take advantage of new technologies. It is also possible to integrate new features and technologies into the chip model to meet the needs of advanced communication systems.
Overall, the XC2V4000-6BFG957I chip model is a highly advanced, reliable, and cost-effective solution for many applications. It is expected to continue to be in high demand in the future as the demand for high-performance, low-power, and high-density logic solutions increases. The model is also highly flexible and upgradeable, making it suitable for applications that require advanced communication protocols and interfaces and for applications that require the support of new technologies.
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