AMD Xilinx
XC2V4000-6BFG957C
XC2V4000-6BFG957C ECAD Model
XC2V4000-6BFG957C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 684 | |
| Number of Outputs | 684 | |
| Number of Logic Cells | 51840 | |
| Number of Equivalent Gates | 4000000 | |
| Number of CLBs | 5760 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5760 CLBS, 4000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA957,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2V4000-6BFG957C Datasheet Download
XC2V4000-6BFG957C Overview
The XC2V4000-6BFG957C chip model is a powerful device that offers a wide range of possibilities for advanced communication systems. It was designed with the intention of providing users with an efficient solution to their communication needs. This chip model features a high-speed, low-power design that allows for greater data transfer rates and better power management. It also has a wide range of features such as a built-in memory controller, a high-speed serial interface, and a wide variety of I/O ports.
The XC2V4000-6BFG957C chip model is an ideal choice for networks that require high-speed data transfer and efficient power management. It can be used in a wide range of intelligent scenarios, from home automation systems to industrial automation systems. Moreover, this chip model is capable of supporting the development of future intelligent robots. It is capable of providing the necessary hardware and software support for the development and popularization of future intelligent robots.
In order to use the XC2V4000-6BFG957C chip model effectively, users need to have a certain level of technical knowledge. The chip model requires users to have a basic understanding of computer hardware, software, and networking. Additionally, users need to have a good understanding of the different types of I/O ports and memory controllers in order to make the most of the chip model. Furthermore, users should also have a good understanding of the different types of communication protocols in order to maximize the chip model’s potential.
The XC2V4000-6BFG957C chip model is an excellent choice for those looking for an efficient solution for their communication needs. It is capable of providing users with a wide range of features and benefits, making it a great choice for networks and intelligent systems. With the right technical knowledge and understanding, users can make the most out of this chip model and take advantage of its potential for the development and popularization of future intelligent robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||