AMD Xilinx
XC2V4000-6BF957I
XC2V4000-6BF957I ECAD Model
XC2V4000-6BF957I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 684 | |
| Number of Outputs | 684 | |
| Number of Logic Cells | 51840 | |
| Number of Equivalent Gates | 4000000 | |
| Number of CLBs | 5760 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5760 CLBS, 4000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA957,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V4000-6BF957I Datasheet Download
XC2V4000-6BF957I Overview
The chip model XC2V4000-6BF957I is a powerful model that is widely used in the technology industry. Developed by Xilinx, this chip model has been widely adopted by many companies and organizations for a variety of purposes. It is important to understand the industry trends of the chip model XC2V4000-6BF957I, as well as its future development and potential applications.
The XC2V4000-6BF957I was designed to be highly versatile and flexible, allowing for a wide range of applications. It is capable of supporting a variety of advanced communication systems, making it ideal for use in the development of future intelligent robots. The chip model is also capable of being upgraded, allowing for the potential of future development and expansion.
When considering the industry trends of the chip model XC2V4000-6BF957I, it is important to consider whether the application environment requires the support of new technologies. Depending on the specific technologies that are needed, the chip model may need to be upgraded or modified in order to be compatible with the new technologies. Additionally, it is important to consider the technical talents that are needed in order to use the model effectively.
In conclusion, the chip model XC2V4000-6BF957I is a powerful and versatile model that is widely used in the technology industry. It was designed to be highly flexible and capable of supporting a variety of advanced communication systems, making it ideal for use in the development of future intelligent robots. It is important to consider the industry trends of the chip model XC2V4000-6BF957I, as well as the potential for future development and whether the application environment requires the support of new technologies. Additionally, it is important to consider the technical talents that are needed in order to use the model effectively.
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| QTY | Unit Price | Ext Price |
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