AMD Xilinx
XC2V4000-4BFG957C
XC2V4000-4BFG957C ECAD Model
XC2V4000-4BFG957C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 684 | |
| Number of Outputs | 684 | |
| Number of Logic Cells | 51840 | |
| Number of Equivalent Gates | 4000000 | |
| Number of CLBs | 5760 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5760 CLBS, 4000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA957,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V4000-4BFG957C Datasheet Download
XC2V4000-4BFG957C Overview
The XC2V4000-4BFG957C chip model is a powerful and versatile integrated circuit designed to meet the needs of the modern electronics industry. It is a high-performance, flexible, and cost-effective solution that provides a range of features and capabilities that are ideal for a variety of applications. This chip model is designed to meet the requirements of a wide range of industries, including communications, automotive, industrial, and consumer electronics.
The XC2V4000-4BFG957C chip model has a number of advantages over other similar products. It has a high clock speed of up to 400 MHz and a large memory capacity of up to 4 GB. It also offers low power consumption, excellent thermal performance, and a high level of integration. The chip model is also designed with a number of features that make it suitable for a range of applications, such as high-speed data transfer, digital signal processing, and embedded control.
In terms of expected demand trends, the XC2V4000-4BFG957C chip model is expected to see a steady increase in demand in the coming years. This is due to the increasing demand for high-performance, cost-effective solutions in the modern electronics industry. The chip model is also expected to be used in a variety of applications, including communications, automotive, industrial, and consumer electronics.
The original design intention of the XC2V4000-4BFG957C chip model was to provide a powerful and flexible solution for a wide range of applications. The chip model was designed to meet the requirements of a variety of industries, including communications, automotive, industrial, and consumer electronics. It was also designed with a number of features that make it suitable for a range of applications, such as high-speed data transfer, digital signal processing, and embedded control.
In terms of future upgrades, the XC2V4000-4BFG957C chip model is expected to remain a powerful and versatile solution for a variety of applications. The chip model is expected to be upgraded and improved in the future to meet the demands of the modern electronics industry. It is also expected to be used in a variety of advanced communication systems.
The XC2V4000-4BFG957C chip model has a number of specific design requirements that need to be met in order to be successful. These include a high clock speed of up to 400 MHz and a large memory capacity of up to 4 GB. It also needs to be designed with low power consumption, excellent thermal performance, and a high level of integration.
In terms of actual case studies, the XC2V4000-4BFG957C chip model has been successfully used in a variety of applications, including communications, automotive, industrial, and consumer electronics. It has also been used in a number of advanced communication systems.
When using the XC2V4000-4BFG957C chip model, it is important to take all safety precautions and ensure that the chip model is properly installed and maintained. It is also important to ensure that the chip model is used in accordance with the manufacturer's instructions and guidelines.
You May Also Be Interested In
2,208 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,171.8000 | $1,171.8000 |
| 10+ | $1,159.2000 | $11,592.0000 |
| 100+ | $1,096.2000 | $109,620.0000 |
| 1000+ | $1,033.2000 | $516,600.0000 |
| 10000+ | $945.0000 | $945,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||