AMD Xilinx
XC2V40-6CS144I
XC2V40-6CS144I ECAD Model
XC2V40-6CS144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 88 | |
| Number of Outputs | 88 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 40000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V40-6CS144I Datasheet Download
XC2V40-6CS144I Overview
The chip model XC2V40-6CS144I is a high-performance programmable logic device that is suitable for a wide range of applications, including digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming and design. This model has the advantage of being able to be used in a variety of applications and is suitable for high-performance digital signal processing.
The industry trends of the chip model XC2V40-6CS144I and the future development of related industries depend on the specific technologies that are needed. For example, if the application environment requires the support of new technologies such as artificial intelligence (AI) or machine learning, then the chip model XC2V40-6CS144I can be used to develop and popularize future intelligent robots.
In order to use the chip model XC2V40-6CS144I effectively, technical talents with a good understanding of HDL language and related technologies are needed. Those who are familiar with the design and programming of digital signal processing, embedded processing, and image processing systems are best suited to use the chip model. Additionally, those who have experience in developing and popularizing AI and machine learning technologies may also be able to use the chip model to develop intelligent robots.
In conclusion, the chip model XC2V40-6CS144I is a versatile programmable logic device that is suitable for a variety of applications, including digital signal processing, embedded processing, and image processing. In order to use the chip model effectively, technical talents with a good understanding of HDL language and related technologies are needed. The industry trends of the chip model and the future development of related industries depend on the specific technologies that are needed. The chip model can be used to develop and popularize future intelligent robots if the application environment requires the support of new technologies such as AI or machine learning.
You May Also Be Interested In
2,008 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||