AMD Xilinx
XC2V40-6CS144C
XC2V40-6CS144C ECAD Model
XC2V40-6CS144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 88 | |
| Number of Outputs | 88 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 40000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2V40-6CS144C Datasheet Download
XC2V40-6CS144C Overview
The Xilinx XC2V40-6CS144C chip model is a powerful and versatile programmable logic device designed to meet the needs of a wide range of applications. It is suitable for use in a variety of communication systems, from low-end to high-end, and has the potential to be upgraded for even more sophisticated applications.
The XC2V40-6CS144C chip model is a Field Programmable Gate Array (FPGA) device with a logic cell array of 144 logic cells. It is designed with a 6-layer copper interconnection structure, and has a capacity of up to 40 million system gates. This chip model is also equipped with a number of features such as high-speed I/O, high-speed clock management, and high-density programmable logic blocks.
The XC2V40-6CS144C chip model is suitable for a wide range of applications, including digital signal processing, embedded systems, industrial automation, and communications. It is also suitable for use in advanced communication systems, such as high-speed Ethernet, Wi-Fi, and Bluetooth. It is also suitable for use in a variety of industrial applications, such as industrial control, robotics, and machine vision.
The XC2V40-6CS144C chip model is also suitable for use in the development and popularization of future intelligent robots. It is well-suited for use in autonomous robots, as it provides the necessary features for controlling the robot’s movements and actions. The chip model can also be used to create sophisticated artificial intelligence systems, as it provides the necessary features for processing and analyzing large amounts of data.
In order to effectively use the XC2V40-6CS144C chip model, it is important to have a good understanding of the device’s features and capabilities. Technical professionals with expertise in digital signal processing, embedded systems, and communications are needed in order to make the most of the chip model’s features. Additionally, knowledge of software development and programming languages such as Verilog and VHDL is helpful in order to create complex systems with the chip model.
In conclusion, the Xilinx XC2V40-6CS144C chip model is a powerful and versatile programmable logic device that is suitable for a wide range of applications. It is well-suited for use in advanced communication systems, industrial applications, and the development and popularization of future intelligent robots. Technical professionals with expertise in digital signal processing, embedded systems, and communications are needed in order to make the most of the chip model’s features.
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