AMD Xilinx
XC2V40-4CS144C
XC2V40-4CS144C ECAD Model
XC2V40-4CS144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 88 | |
| Number of Outputs | 88 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 40000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2V40-4CS144C Datasheet Download
XC2V40-4CS144C Overview
The Xilinx XC2V40-4CS144C chip model is a powerful and efficient digital signal processor (DSP) designed for high-performance applications. It is based on the Virtex-II Pro family of Field Programmable Gate Arrays (FPGAs) and is capable of supporting complex digital signal processing tasks. This chip model requires the use of HDL language for programming and is suitable for embedded processing, image processing and other high-performance applications.
The XC2V40-4CS144C chip model offers several advantages compared to other chip models. It is capable of operating at high speeds with low power consumption, making it ideal for applications where speed and efficiency are key. Furthermore, it is highly reliable and can be easily integrated into existing systems. In addition, its internal architecture provides support for multiple clock frequencies, making it suitable for a variety of applications.
The demand for the XC2V40-4CS144C chip model is expected to increase in the future, as the need for high-performance digital signal processing solutions continues to grow. In particular, this chip model is expected to be in high demand in the automotive, aerospace, and medical industries, which require fast and reliable processing solutions. Furthermore, as the Internet of Things (IoT) continues to expand, the demand for this chip model is expected to increase, as it is capable of supporting complex digital signal processing tasks.
The XC2V40-4CS144C chip model can be used in a variety of network applications, including wireless communication, network security, and network management. This chip model can also be used in intelligent scenarios, such as natural language processing, computer vision, and robotics. Furthermore, this chip model is capable of supporting fully intelligent systems, such as autonomous vehicles and intelligent homes.
The XC2V40-4CS144C chip model is a powerful and efficient DSP solution that is suitable for a variety of high-performance applications. It is highly reliable and can be easily integrated into existing systems. Furthermore, its internal architecture provides support for multiple clock frequencies, making it ideal for a variety of applications. The demand for this chip model is expected to increase in the future, as the need for high-performance digital signal processing solutions continues to grow. In addition, this chip model can be used in a variety of network applications and intelligent scenarios, as well as in fully intelligent systems.
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