AMD Xilinx
XC2V3000-6BFG957I
XC2V3000-6BFG957I ECAD Model
XC2V3000-6BFG957I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V3000-6BFG957I Datasheet Download
XC2V3000-6BFG957I Overview
The XC2V3000-6BFG957I chip model is a highly advanced integrated circuit developed by Xilinx, Inc. It is an FPGA (Field Programmable Gate Array) device with a high-performance 6-input lookup table (LUT) array. This chip model is designed to meet the needs of a wide range of applications, including high-speed communications, high-performance computing, and advanced signal processing.
The XC2V3000-6BFG957I chip model offers a number of advantages over traditional FPGA devices. It has a high-performance 6-input LUT array, which enables it to process data quickly and accurately. It also has a low power consumption, making it ideal for applications where power efficiency is essential. Additionally, it has a wide range of configurable options, allowing it to be tailored to the specific needs of a particular application.
The XC2V3000-6BFG957I chip model has been designed with the future in mind. It is built to support the latest communication protocols, allowing it to be used in advanced communication systems. It also has the capability to be upgraded, allowing it to remain relevant in the future. Furthermore, it is capable of being used in intelligent scenarios, such as networks, and can be used to create fully intelligent systems.
Due to its many advantages, the XC2V3000-6BFG957I chip model is expected to be in high demand in the future. Its low power consumption and high performance make it ideal for applications in the communications, computing, and signal processing industries. It is also suitable for use in networks and intelligent scenarios, making it a valuable asset for the development of fully intelligent systems. As such, there is a growing demand for the XC2V3000-6BFG957I chip model, and it is likely to remain in high demand in the years to come.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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