XC2V3000-6BFG957C
XC2V3000-6BFG957C
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AMD Xilinx

XC2V3000-6BFG957C

XC2V3000-6BFG957C
AMD Xilinx
F20-XC2V3000-6BFG957C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957
40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957
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XC2V3000-6BFG957C Datasheet (PDF)
XC2V3000-6BFG957C Document (PDF)

XC2V3000-6BFG957C ECAD Model

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XC2V3000-6BFG957C Attributes

Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Equivalent Gates 3000000
Number of CLBs 3584
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 3584 CLBS, 3000000 GATES
Clock Frequency-Max 820 MHz
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B957
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 957
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957
Pin Count 957
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC2V3000-6BFG957C Datasheet Download

XC2V3000-6BFG957C Overview


The XC2V3000-6BFG957C chip model is a high-performance, low-power programmable logic device (PLD) that is designed to provide a cost-effective solution for a wide range of applications. It offers a variety of features and benefits, including a high-speed logic array, a wide range of I/O options, and a low power consumption. It is also highly configurable, allowing for a wide range of applications.


The XC2V3000-6BFG957C chip model has a number of advantages that make it an attractive choice for many industries. It is a reliable and cost-effective solution for a variety of applications, including industrial automation, medical, automotive, telecommunications, and consumer electronics. It is also designed to be easily upgradable and reconfigurable, allowing for quick and easy expansion and customization.


The demand for the XC2V3000-6BFG957C chip model is expected to continue to grow in the future. This is due to its ability to meet the needs of many industries, its low power consumption, and its configurability. As the need for more complex applications grows, the XC2V3000-6BFG957C chip model will be able to meet these demands.


The XC2V3000-6BFG957C chip model can be used in a variety of network and intelligent scenarios. It can be used in industrial automation, medical systems, automotive systems, telecommunications systems, and consumer electronics. It is also well suited for use in the era of fully intelligent systems, as it is highly configurable and can be easily upgraded and reconfigured.


The XC2V3000-6BFG957C chip model is designed to meet specific design requirements. It is designed for a wide range of applications, including industrial automation, medical, automotive, telecommunications, and consumer electronics. It is also designed for high speed logic array, wide range of I/O options, and low power consumption.


Case studies have been conducted to assess the performance of the XC2V3000-6BFG957C chip model. These studies have shown that the chip model is reliable and cost-effective, and can meet the needs of many industries. It is also upgradable and reconfigurable, allowing for quick and easy expansion and customization.


When using the XC2V3000-6BFG957C chip model, there are a few precautions that should be taken. It is important to ensure that the chip is properly installed and configured, and that the appropriate power supply is used. Additionally, it is important to ensure that the chip is not exposed to any extreme temperatures or moisture, as this can cause damage to the chip.



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Parts Index

XC2V3000-6BFG957
2
XC2V3000-6BFG
2
XC2V3000-6
38
XC2V3000-
131
XC2V3000
132
XC2V
1963
XC2
4121
XC
65616