AMD Xilinx
XC2V3000-6BF957I
XC2V3000-6BF957I ECAD Model
XC2V3000-6BF957I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 684 | |
| Number of Outputs | 684 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA957,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V3000-6BF957I Datasheet Download
XC2V3000-6BF957I Overview
The chip model XC2V3000-6BF957I is a powerful and versatile model that has been gaining traction in the industry due to its ability to provide reliable and high-performance solutions. It has been designed to support a wide range of applications, ranging from small to medium-sized businesses, to large-scale enterprises. It is capable of supporting a variety of networks and applications, including cloud computing, the Internet of Things (IoT), and artificial intelligence (AI).
The XC2V3000-6BF957I is equipped with advanced features such as a high-speed processor, multiple I/O ports, and a wide range of memory options. These features make it suitable for a variety of applications, such as data processing, network management, and communication. It also has an integrated power management system, which allows for energy efficiency and improved system performance.
In terms of future industry trends, the XC2V3000-6BF957I is expected to remain a popular choice for businesses and organizations that require reliable and high-performance solutions. With the increasing demand for intelligent systems, the chip model is likely to be used in a variety of intelligent scenarios, such as facial recognition, autonomous driving, and natural language processing. Furthermore, with the emergence of 5G networks, the chip model is expected to be used in many more applications as it is capable of supporting high data rates and low latency.
The XC2V3000-6BF957I is a versatile and powerful chip model that is capable of supporting a wide range of applications. It is expected to remain a popular choice in the industry as businesses and organizations continue to demand reliable and high-performance solutions. Furthermore, with the emergence of 5G networks and the increasing demand for intelligent systems, the chip model is likely to be used in many more applications in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||