XC2V3000-6BF957C
XC2V3000-6BF957C
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rohs

AMD Xilinx

XC2V3000-6BF957C


XC2V3000-6BF957C
F20-XC2V3000-6BF957C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957
40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957

XC2V3000-6BF957C ECAD Model


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XC2V3000-6BF957C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 684
Number of Outputs 684
Number of Logic Cells 32256
Number of Equivalent Gates 3000000
Number of CLBs 3584
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 3584 CLBS, 3000000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B957
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 957
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA957,31X31,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957
Pin Count 957
ECCN Code 3A991.D

XC2V3000-6BF957C Datasheet Download


XC2V3000-6BF957C Overview



The Xilinx XC2V3000-6BF957C chip is a reprogrammable field-programmable gate array (FPGA) device designed for high-performance applications. It is designed to meet the needs of a wide range of applications, including communication systems, networks, and intelligent systems. The chip features a 6-million-gate capacity, 6-bit wide I/O, and up to 300 MHz of internal clock speed.


The XC2V3000-6BF957C chip was designed to be versatile and highly configurable. Its original design intention was to provide the necessary performance and flexibility for a variety of applications. The chip is capable of being upgraded to meet the changing needs of various applications, allowing it to remain relevant in the future. It can also be used in advanced communication systems due to its high-performance capabilities.


The XC2V3000-6BF957C chip is suitable for a variety of intelligent scenarios, such as machine learning, artificial intelligence, and autonomous systems. It can be used in networks to enable faster communication speeds and better data processing. The chip can also be used in the era of fully intelligent systems, allowing for the implementation of advanced algorithms and applications.


In terms of product description and specific design requirements, the XC2V3000-6BF957C chip has a 6-million-gate capacity, 6-bit wide I/O, and up to 300 MHz of internal clock speed. It also features a wide range of configurable options, allowing for flexibility in its application. The chip has been designed to be reliable and efficient, with a low power consumption and high-performance capabilities.


The XC2V3000-6BF957C chip has been used in a variety of applications and has proven to be successful in each. Case studies have shown that the chip can be used to improve communication speeds and data processing, as well as to enable intelligent scenarios such as machine learning and autonomous systems. However, it is important to note that the chip is not suitable for all applications and should be used with caution to ensure its effectiveness.



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Unit Price: $609.6148
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QTY Unit Price Ext Price
1+ $566.9418 $566.9418
10+ $560.8456 $5,608.4562
100+ $530.3649 $53,036.4876
1000+ $499.8841 $249,942.0680
10000+ $457.2111 $457,211.1000
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