AMD Xilinx
XC2V3000-4BFG957C
XC2V3000-4BFG957C ECAD Model
XC2V3000-4BFG957C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V3000-4BFG957C Datasheet Download
XC2V3000-4BFG957C Overview
The XC2V3000-4BFG957C chip model is a high-performance digital signal processor that provides a wide range of applications for embedded processing, image processing, and other digital signal processing tasks. This chip model requires the use of the HDL language, and is suitable for both high-performance and low-power requirements.
The chip model XC2V3000-4BFG957C can be applied to a wide range of network applications and intelligent scenarios. It is possible to use this model in the era of fully intelligent systems, as the chip model is able to process high-speed and complex data. This chip model can be used to develop and popularize future intelligent robots, as it is able to process data quickly and accurately.
In order to use the XC2V3000-4BFG957C chip model effectively, technical talents need to be knowledgeable in the HDL language. They should also be familiar with the chip model’s architecture and be able to implement the data processing algorithms efficiently. Additionally, they should be able to optimize the chip model’s power consumption and performance.
Overall, the XC2V3000-4BFG957C chip model is a powerful digital signal processor that is suitable for a wide range of applications. It can be used for network applications, intelligent scenarios, and the development and popularization of future intelligent robots. Technical talents need to be knowledgeable in the HDL language and be able to optimize the chip model’s power consumption and performance in order to use it effectively.
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|---|---|---|
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