AMD Xilinx
XC2V250-6CS144I
XC2V250-6CS144I ECAD Model
XC2V250-6CS144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 92 | |
| Number of Logic Cells | 3456 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 250000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V250-6CS144I Datasheet Download
XC2V250-6CS144I Overview
The XC2V250-6CS144I chip model is an advanced integrated circuit from Xilinx that is designed to increase the performance of a wide range of applications. It is a versatile and powerful chip that can be used in a variety of industries, such as communications, industrial automation, medical, and consumer electronics. This chip model is known for its high performance, low power consumption, and low cost.
The XC2V250-6CS144I chip model is expected to be in high demand in the future due to its many advantages. It is capable of providing high-speed data transfer and can be used in a wide range of applications. It is also highly reliable and can be used in harsh environments. Furthermore, the chip model is capable of performing multiple functions simultaneously, which makes it suitable for use in complex systems.
The XC2V250-6CS144I chip model is expected to be applied in networks in the future. It can be used to facilitate communication between devices, as well as to increase the efficiency of data transfer. Furthermore, it can be used to provide secure networks and to increase the speed of data transfer. Additionally, the chip model can be used to create intelligent networks that can be used to automate processes and to improve the performance of a variety of applications.
The XC2V250-6CS144I chip model can also be used in intelligent scenarios in the future. It can be used to create intelligent systems that are capable of making decisions and performing tasks autonomously. Furthermore, it can be used to create intelligent robots that can be used to perform a variety of tasks. Additionally, the chip model can be used to create intelligent systems that can be used to automate processes and to improve the performance of a variety of applications.
The XC2V250-6CS144I chip model can be used in the development and popularization of future intelligent robots. It can be used to create robots that are capable of performing complex tasks autonomously. Furthermore, the chip model can be used to create robots that are capable of learning and adapting to their environment. Additionally, the chip model can be used to create robots that can be used to perform a variety of tasks, such as cleaning, sorting, and transporting.
In order to use the XC2V250-6CS144I chip model effectively, a variety of technical talents are required. It is important to have an understanding of the chip model and its capabilities in order to be able to use it properly. Additionally, it is important to have a good understanding of the applications that the chip model can be used for in order to be able to use it effectively. Furthermore, it is important to have a good understanding of the hardware and software components of the chip model in order to be able to use it properly. Finally, it is important to have a good understanding of the programming languages and platforms used to create applications for the chip model in order to be able to use it properly.
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