AMD Xilinx
XC2V250-6CS144C
XC2V250-6CS144C ECAD Model
XC2V250-6CS144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 92 | |
| Number of Logic Cells | 3456 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 250000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2V250-6CS144C Datasheet Download
XC2V250-6CS144C Overview
The XC2V250-6CS144C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to use the HDL language, making it a great choice for those who need to develop complex systems.
The industry trends of the XC2V250-6CS144C chip model are constantly evolving, and the future development of related industries will depend on the specific technologies needed. The original design intention of the XC2V250-6CS144C chip model was to provide a powerful and efficient platform for digital signal processing, embedded processing, and image processing. It is also possible to upgrade the chip model in the future to add more features and capabilities.
The XC2V250-6CS144C chip model can be used in advanced communication systems, providing the necessary technology for efficient and reliable communication. It is also capable of handling complex tasks, making it a great choice for those who need to develop sophisticated communication systems.
The XC2V250-6CS144C chip model is a powerful and reliable tool for digital signal processing, embedded processing, and image processing. It is designed to use the HDL language, making it a great choice for those who need to develop complex systems. The industry trends of the XC2V250-6CS144C chip model are constantly evolving, and the future development of related industries will depend on the specific technologies needed. The XC2V250-6CS144C chip model can also be applied to advanced communication systems, providing the necessary technology for efficient and reliable communication. With the possibility of future upgrades, the XC2V250-6CS144C chip model is a great choice for those who need to develop sophisticated communication systems.
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|---|---|---|
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