AMD Xilinx
XC2V250-5CS144I
XC2V250-5CS144I ECAD Model
XC2V250-5CS144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 92 | |
| Number of Logic Cells | 3456 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 250000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2V250-5CS144I Datasheet Download
XC2V250-5CS144I Overview
The chip model XC2V250-5CS144I is a high-performance, low-power FPGA from Xilinx that has been designed to meet the needs of the modern digital system. It is a 5-layer, 144-pin device that offers a wide range of features, including high-speed transceivers, high-performance logic, and high-density memory. The chip model XC2V250-5CS144I is well-suited for applications in a variety of industries, including automotive, industrial, medical, and aerospace.
The chip model XC2V250-5CS144I provides a variety of advantages to its users. It offers high-speed transceivers that support up to 12.5 Gbps data rates, enabling it to be used in a variety of communication systems. Additionally, the device offers a high-performance logic architecture that enables it to handle complex tasks with ease. Furthermore, the device is capable of supporting high-density memory, allowing for large amounts of data to be stored. The chip model XC2V250-5CS144I is also power-efficient, reducing the amount of energy needed to power the device.
In terms of future industry trends, it is expected that the demand for the chip model XC2V250-5CS144I will continue to increase. This is due to the fact that the device is well-suited for a variety of applications and is capable of meeting the needs of modern digital systems. Furthermore, the device is capable of supporting advanced communication systems, making it a viable option for a variety of industries.
The original design intention of the chip model XC2V250-5CS144I was to provide a high-performance, low-power FPGA that could be used in a variety of applications. The device was designed to be power-efficient and capable of supporting high-speed transceivers and high-density memory. The device has been successful in meeting these design goals and is well-suited for a variety of industries.
In terms of future upgrades, the chip model XC2V250-5CS144I is capable of being upgraded to support newer technologies. This could include the addition of new transceivers or the integration of new logic architectures. Additionally, the device could be upgraded to support advanced communication systems, allowing for the device to be used in a variety of industries.
Overall, the chip model XC2V250-5CS144I is a high-performance, low-power FPGA that is well-suited for a variety of applications. It offers a variety of advantages, including high-speed transceivers, high-performance logic, and high-density memory. The device is also capable of supporting advanced communication systems, making it a viable option for a variety of industries. The device is expected to see an increase in demand in the future, and it is capable of being upgraded to support new technologies and advanced communication systems.
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