AMD Xilinx
XC2V250-4CS144I
XC2V250-4CS144I ECAD Model
XC2V250-4CS144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 92 | |
| Number of Logic Cells | 3456 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 250000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2V250-4CS144I Datasheet Download
XC2V250-4CS144I Overview
The XC2V250-4CS144I chip model is a powerful and versatile piece of technology that can be used for a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and other tasks. It is capable of handling large amounts of data quickly and accurately, making it an ideal choice for a variety of applications.
The original design intention of the XC2V250-4CS144I chip model was to provide users with the ability to process and store large amounts of data quickly and accurately, while also allowing for future upgrades. This chip model can be used for advanced communication systems, allowing for faster data transmission and better security. It is also capable of being used for the development and popularization of future intelligent robots, as it is capable of handling complex tasks and algorithms.
In order to use the XC2V250-4CS144I chip model effectively, users must be familiar with the HDL language. This language is used to program the chip, and is required for its use. Furthermore, users must have a good understanding of the chip model itself, as well as the various tasks and algorithms it is capable of handling. Additionally, users must have a good understanding of the hardware components and how they interact with the chip.
Overall, the XC2V250-4CS144I chip model is a powerful and versatile piece of technology that can be used for a variety of applications. With the right knowledge and expertise, it can be used to develop and popularize future intelligent robots, as well as provide users with the ability to process and store large amounts of data quickly and accurately. It is a great choice for those looking for a reliable and powerful chip model.
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