AMD Xilinx
XC2V2000-6BG575I
XC2V2000-6BG575I ECAD Model
XC2V2000-6BG575I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 408 | |
| Number of Outputs | 408 | |
| Number of Logic Cells | 24192 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B575 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Terminals | 575 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA575,24X24,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575 | |
| Pin Count | 575 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V2000-6BG575I Datasheet Download
XC2V2000-6BG575I Overview
The XC2V2000-6BG575I chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using the HDL language, which provides the user with a wide range of options when it comes to creating complex digital systems. The chip model also offers a number of advantages, including high-speed operation, low power consumption, and a small footprint.
The XC2V2000-6BG575I chip model is expected to be in high demand in related industries in the future. This is due to the increasing demand for high-performance digital signal processing, embedded processing, and image processing applications. As the demand for these applications increases, the need for powerful and reliable chips like the XC2V2000-6BG575I will only continue to grow.
The XC2V2000-6BG575I chip model can also be used in networks and for intelligent scenarios. It is capable of handling complex tasks, such as facial recognition, object detection, and image recognition. This makes it an ideal choice for applications in the internet of things, autonomous driving, and other intelligent systems. The chip model is also capable of handling large amounts of data, making it suitable for use in the era of fully intelligent systems.
Overall, the XC2V2000-6BG575I chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is expected to be in high demand in related industries in the future, and can be used in networks and for intelligent scenarios. It is capable of handling complex tasks and large amounts of data, making it suitable for use in the era of fully intelligent systems.
You May Also Be Interested In
1,920 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||