XC2V2000-4BG575C
XC2V2000-4BG575C
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rohs

AMD Xilinx

XC2V2000-4BG575C


XC2V2000-4BG575C
F20-XC2V2000-4BG575C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575
31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575

XC2V2000-4BG575C ECAD Model


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XC2V2000-4BG575C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 408
Number of Outputs 408
Number of Logic Cells 24192
Number of Equivalent Gates 2000000
Number of CLBs 2688
Combinatorial Delay of a CLB-Max 440 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 2688 CLBS, 2000000 GATES
Clock Frequency-Max 650 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B575
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Number of Terminals 575
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA575,24X24,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575
Pin Count 575
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC2V2000-4BG575C Datasheet Download


XC2V2000-4BG575C Overview



The XC2V2000-4BG575C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is capable of handling high-performance tasks and requires the use of HDL language for programming. This chip model is suitable for many applications, such as network applications and intelligent systems.


The XC2V2000-4BG575C chip model is a versatile device that can be used in a variety of scenarios. It has a wide range of features, such as high-speed data processing, embedded processing, and image processing. It is also capable of handling complex tasks and requires the use of HDL language for programming. The chip model is also suitable for use in intelligent systems and networks.


The product description of the XC2V2000-4BG575C chip model includes its features, specifications, and design requirements. It has a high-speed data processing capability, embedded processing, and image processing. It also has a wide range of features, such as high-speed data processing, embedded processing, and image processing. The design requirements for the chip model include the use of HDL language for programming and the ability to handle complex tasks.


Case studies and precautions for the XC2V2000-4BG575C chip model can be found in the product description. It is important to note that the chip model requires the use of HDL language for programming, and it is important to be aware of the design requirements for the chip model. Additionally, it is important to be aware of the potential risks and limitations of the chip model.


In conclusion, the XC2V2000-4BG575C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is suitable for many applications, such as network applications and intelligent systems. It requires the use of HDL language for programming and has a wide range of features. It is important to be aware of the design requirements for the chip model and the potential risks and limitations.



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Unit Price: $402.08
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QTY Unit Price Ext Price
1+ $373.9344 $373.9344
10+ $369.9136 $3,699.1360
100+ $349.8096 $34,980.9600
1000+ $329.7056 $164,852.8000
10000+ $301.5600 $301,560.0000
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