
AMD Xilinx
XC2V2000-4BG575C
XC2V2000-4BG575C ECAD Model
XC2V2000-4BG575C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 408 | |
Number of Outputs | 408 | |
Number of Logic Cells | 24192 | |
Number of Equivalent Gates | 2000000 | |
Number of CLBs | 2688 | |
Combinatorial Delay of a CLB-Max | 440 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2688 CLBS, 2000000 GATES | |
Clock Frequency-Max | 650 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B575 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Number of Terminals | 575 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA575,24X24,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 31 mm | |
Length | 31 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575 | |
Pin Count | 575 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2V2000-4BG575C Datasheet Download
XC2V2000-4BG575C Overview
The XC2V2000-4BG575C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is capable of handling high-performance tasks and requires the use of HDL language for programming. This chip model is suitable for many applications, such as network applications and intelligent systems.
The XC2V2000-4BG575C chip model is a versatile device that can be used in a variety of scenarios. It has a wide range of features, such as high-speed data processing, embedded processing, and image processing. It is also capable of handling complex tasks and requires the use of HDL language for programming. The chip model is also suitable for use in intelligent systems and networks.
The product description of the XC2V2000-4BG575C chip model includes its features, specifications, and design requirements. It has a high-speed data processing capability, embedded processing, and image processing. It also has a wide range of features, such as high-speed data processing, embedded processing, and image processing. The design requirements for the chip model include the use of HDL language for programming and the ability to handle complex tasks.
Case studies and precautions for the XC2V2000-4BG575C chip model can be found in the product description. It is important to note that the chip model requires the use of HDL language for programming, and it is important to be aware of the design requirements for the chip model. Additionally, it is important to be aware of the potential risks and limitations of the chip model.
In conclusion, the XC2V2000-4BG575C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is suitable for many applications, such as network applications and intelligent systems. It requires the use of HDL language for programming and has a wide range of features. It is important to be aware of the design requirements for the chip model and the potential risks and limitations.
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3,016 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $373.9344 | $373.9344 |
10+ | $369.9136 | $3,699.1360 |
100+ | $349.8096 | $34,980.9600 |
1000+ | $329.7056 | $164,852.8000 |
10000+ | $301.5600 | $301,560.0000 |
The price is for reference only, please refer to the actual quotation! |