AMD Xilinx
XC2V1500-6BG575I
XC2V1500-6BG575I ECAD Model
XC2V1500-6BG575I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 392 | |
| Number of Outputs | 392 | |
| Number of Logic Cells | 17280 | |
| Number of Equivalent Gates | 1500000 | |
| Number of CLBs | 1920 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1920 CLBS, 1500000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B575 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Terminals | 575 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA575,24X24,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575 | |
| Pin Count | 575 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V1500-6BG575I Datasheet Download
XC2V1500-6BG575I Overview
The Xilinx XC2V1500-6BG575I chip model is a powerful and reliable integrated circuit (IC) that has been widely used in various industries. It is well-suited for applications that require high-speed data processing and high-density logic. It is designed with a 6-layer metal interconnect and a 0.18 micron CMOS process technology. The XC2V1500-6BG575I offers a variety of features that make it an excellent choice for many applications.
The XC2V1500-6BG575I chip model has several advantages that make it an attractive choice for many industries. It has a high-performance clock frequency of up to 200 MHz, which makes it suitable for applications that require high-speed data processing. It also has a very low power consumption, making it an ideal choice for battery-powered applications. Additionally, it has an enhanced I/O capability, which allows it to be used in a wide range of applications.
The XC2V1500-6BG575I chip model is expected to remain in demand in the future due to its excellent performance and reliability. As technology advances, the XC2V1500-6BG575I will be able to support more advanced communication systems. It is also likely that the chip model will be upgraded to support new technologies, such as 5G networks. This will enable the chip model to remain competitive in the market.
The XC2V1500-6BG575I chip model was designed with the intention of providing a reliable and efficient solution for high-speed data processing and high-density logic applications. It has been used in a variety of industries, from automotive to aerospace, and its performance and reliability have made it an attractive choice for many applications. As technology continues to evolve, the XC2V1500-6BG575I will be able to support more advanced communication systems, as well as new technologies. This will ensure that the XC2V1500-6BG575I remains a competitive and reliable choice for many industries in the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||