
AMD Xilinx
XC2V1500-6BG575C
XC2V1500-6BG575C ECAD Model
XC2V1500-6BG575C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 392 | |
Number of Outputs | 392 | |
Number of Logic Cells | 17280 | |
Number of Equivalent Gates | 1500000 | |
Number of CLBs | 1920 | |
Combinatorial Delay of a CLB-Max | 350 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1920 CLBS, 1500000 GATES | |
Clock Frequency-Max | 820 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B575 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Number of Terminals | 575 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA575,24X24,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 31 mm | |
Length | 31 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575 | |
Pin Count | 575 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2V1500-6BG575C Datasheet Download
XC2V1500-6BG575C Overview
The chip model XC2V1500-6BG575C is a powerful and versatile chip designed for high-performance digital signal processing, embedded processing, and image processing. It is built with the latest technology and requires the use of HDL language for programming. This chip is widely used in various industries, such as automotive, consumer electronics, and industrial automation.
As technology advances and the demand for higher performance increases, the chip model XC2V1500-6BG575C is becoming increasingly popular. With its high processing power, the chip can be used for a variety of tasks, such as machine learning, artificial intelligence, and data analysis. As a result, the chip model XC2V1500-6BG575C is becoming a valuable asset for businesses and organizations.
The chip model XC2V1500-6BG575C is also being used in the development of future intelligent robots. With its powerful processing capabilities, the chip can be used to create robots that can interact with their environment and make decisions based on data. To effectively use the model, technical talents such as software engineers and hardware engineers are needed to program the chip and create the necessary algorithms.
The industry trends of the chip model XC2V1500-6BG575C and the future development of related industries will depend on the specific technologies that are needed. As new technologies become available, the chip model XC2V1500-6BG575C will be able to take advantage of them to further enhance its capabilities. For example, the chip can be used to create robots that can learn from their environment and make decisions based on data.
In conclusion, the chip model XC2V1500-6BG575C is a powerful and versatile chip designed for high-performance digital signal processing, embedded processing, and image processing. It is becoming increasingly popular due to its high processing power and its potential usage in the development of future intelligent robots. To use the chip effectively, technical talents such as software engineers and hardware engineers are needed. The industry trends of the chip model XC2V1500-6BG575C and the future development of related industries will depend on the specific technologies that are needed.
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