XC2V1500-6BG575C
XC2V1500-6BG575C
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rohs

AMD Xilinx

XC2V1500-6BG575C


XC2V1500-6BG575C
F20-XC2V1500-6BG575C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575
31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575

XC2V1500-6BG575C ECAD Model


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XC2V1500-6BG575C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 392
Number of Outputs 392
Number of Logic Cells 17280
Number of Equivalent Gates 1500000
Number of CLBs 1920
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1920 CLBS, 1500000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B575
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Number of Terminals 575
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA575,24X24,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575
Pin Count 575
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC2V1500-6BG575C Datasheet Download


XC2V1500-6BG575C Overview



The chip model XC2V1500-6BG575C is a powerful and versatile chip designed for high-performance digital signal processing, embedded processing, and image processing. It is built with the latest technology and requires the use of HDL language for programming. This chip is widely used in various industries, such as automotive, consumer electronics, and industrial automation.


As technology advances and the demand for higher performance increases, the chip model XC2V1500-6BG575C is becoming increasingly popular. With its high processing power, the chip can be used for a variety of tasks, such as machine learning, artificial intelligence, and data analysis. As a result, the chip model XC2V1500-6BG575C is becoming a valuable asset for businesses and organizations.


The chip model XC2V1500-6BG575C is also being used in the development of future intelligent robots. With its powerful processing capabilities, the chip can be used to create robots that can interact with their environment and make decisions based on data. To effectively use the model, technical talents such as software engineers and hardware engineers are needed to program the chip and create the necessary algorithms.


The industry trends of the chip model XC2V1500-6BG575C and the future development of related industries will depend on the specific technologies that are needed. As new technologies become available, the chip model XC2V1500-6BG575C will be able to take advantage of them to further enhance its capabilities. For example, the chip can be used to create robots that can learn from their environment and make decisions based on data.


In conclusion, the chip model XC2V1500-6BG575C is a powerful and versatile chip designed for high-performance digital signal processing, embedded processing, and image processing. It is becoming increasingly popular due to its high processing power and its potential usage in the development of future intelligent robots. To use the chip effectively, technical talents such as software engineers and hardware engineers are needed. The industry trends of the chip model XC2V1500-6BG575C and the future development of related industries will depend on the specific technologies that are needed.



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