XC2V2000-6BG575C
XC2V2000-6BG575C
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rohs

AMD Xilinx

XC2V2000-6BG575C


XC2V2000-6BG575C
F20-XC2V2000-6BG575C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575
31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575

XC2V2000-6BG575C ECAD Model


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XC2V2000-6BG575C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 408
Number of Outputs 408
Number of Logic Cells 24192
Number of Equivalent Gates 2000000
Number of CLBs 2688
Combinatorial Delay of a CLB-Max 350 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 2688 CLBS, 2000000 GATES
Clock Frequency-Max 820 MHz
Power Supplies 1.5,1.5/3.3,3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B575
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Number of Terminals 575
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA575,24X24,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 31 X 31 MM, 1.27 MM PITCH, MS-034BAN-1, BGA-575
Pin Count 575
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC2V2000-6BG575C Datasheet Download


XC2V2000-6BG575C Overview



The XC2V2000-6BG575C is a high-performance chip model developed by Xilinx, a leading provider of programmable logic solutions. It is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. The chip model is programmed using the HDL (Hardware Description Language) language, making it easier to use and more reliable.


The XC2V2000-6BG575C is designed to meet the needs of high-performance applications in various industries. It has a number of advantages, such as high speed, low power consumption, and a large number of logic elements. These features make it a great choice for applications that require high performance, such as image processing, embedded systems, and digital signal processing.


The original design intention of the XC2V2000-6BG575C was to provide a reliable and high-performance chip model for various applications. The chip model has been designed to meet the needs of a wide range of applications, and is expected to remain popular in the future. The chip model is also designed to be easily upgradable, making it possible to add new features and capabilities as needed.


The XC2V2000-6BG575C is also suitable for advanced communication systems. It has a number of features that make it suitable for such applications, such as high speed and low power consumption. The chip model also has a number of features that make it suitable for advanced communication systems, such as a wide range of logic elements, high-speed clock frequencies, and a large number of I/O pins.


In conclusion, the XC2V2000-6BG575C is a high-performance chip model developed by Xilinx. It is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. The chip model is programmed using the HDL language, making it easier to use and more reliable. The chip model has a number of advantages, such as high speed, low power consumption, and a large number of logic elements. It is also designed to be easily upgradable, making it possible to add new features and capabilities as needed. The chip model is also suitable for advanced communication systems, such as high-speed clock frequencies and a large number of I/O pins. The XC2V2000-6BG575C is expected to remain popular in the future, and is likely to be used in a wide range of applications.



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